{"title":"Dissolution Behavior of Cu-2.0 wt.% Be (Alloy 25) and Cu-0.1 wt.% Fe (C19210) Substrates in Molten Sn-9 wt.%Zn Solder","authors":"A. Laksono, Yu-An Shen, Ting Chen, Y. Yen","doi":"10.1007/s11837-024-06426-4","DOIUrl":null,"url":null,"abstract":"","PeriodicalId":507867,"journal":{"name":"JOM","volume":"145 1","pages":""},"PeriodicalIF":0.0000,"publicationDate":"2024-02-15","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"0","resultStr":null,"platform":"Semanticscholar","paperid":null,"PeriodicalName":"JOM","FirstCategoryId":"1085","ListUrlMain":"https://doi.org/10.1007/s11837-024-06426-4","RegionNum":0,"RegionCategory":null,"ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"","JCRName":"","Score":null,"Total":0}
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