{"title":"Revealing the strengthening mechanism of Cu–Sn composites joint fabricated via in-situ reaction for power electronic packaging","authors":"Qiman Xu, Yudong Cao, Baishan Chen, Jian Zhou, Feng Xue","doi":"10.1016/j.msea.2024.146252","DOIUrl":null,"url":null,"abstract":"","PeriodicalId":503694,"journal":{"name":"Materials Science and Engineering: A","volume":"144 1","pages":""},"PeriodicalIF":0.0000,"publicationDate":"2024-02-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"0","resultStr":null,"platform":"Semanticscholar","paperid":null,"PeriodicalName":"Materials Science and Engineering: A","FirstCategoryId":"1085","ListUrlMain":"https://doi.org/10.1016/j.msea.2024.146252","RegionNum":0,"RegionCategory":null,"ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"","JCRName":"","Score":null,"Total":0}
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