Evaluation of Heat Transfer Rate of Double-Layered Heat Sink Cooling System with High Energy Dissipation

Abstract

The present work evaluates thermal exchange through a double-mini channel heat sink employed as a cooling system for electronic components. Different factors influencing heat exchange enhancement were investigated using Ansys-Fluent software, which enables the simulation of the fluid flow and heat transfer. The evaluation of thermal exchange between the cold fluid and heated solid with high thermal dissipation has been accurately analyzed under the effect of system geometry, fluid nature, and cooling system materials. The numerical outcomes demonstrated that the heat transfer quality significantly increases with the variation of the system shape. In addition, the nature of the fluid and cooling system materials enhances the heat transfer rate.