Assessment of the validity of using a radiant panel in the low-height floor heating

A. Werner-Juszczuk, Alicja Siuta-Olcha
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Abstract

This paper examines the viability of using a radiant panel in lightweight low-height floor heating. In this structure, a dry screed with high thermal resistance is replaced by a low-resistance adhesive layer with reinforcement mesh. The absence of the radiant panel results in a reduction in heat output of 5%–17% for floor finishes with a thermal resistance of 0.001 m2K/W, 50%–54% for 0.05 m2K/W and 60%–62% for 0.1 m2K/W. A structure with a panel is characterised by a lower surface temperature amplitude (maximum 2.4 K) compared to a structure without it (8.8 K), which improves the comfort of floor users. The annual heating cost in a building equipped with the analysed structures was determined. The absence of the panel resulted in a cost increase of 13%, 37% and 79% for floor finish resistances of 0.001, 0.05 and 0.1 m2K/W, respectively. The SPBT for the purchase of radiant panels is 40 years for a floor resistance of 0.001 m2K/W, demonstrating the unprofitability of this solution. For resistances of 0.05 and 0.1 m2K/W, SPBT was 14 and 6 years, respectively. The choice of floor heating system should take into account the required heat output, thermal comfort and economic aspects. This paper assesses the validity of using radiant panels in a low-height floor heating structure, where the dry screed layer is replaced by an adhesive layer with reinforcement mesh. This structure is gaining popularity due to its quick installation and low height but has the disadvantage of the high panel cost. The paper evaluates the effect of panels on heat output and identifies the conditions under which their use is economically justified. Recipients of results are designers and contractors of heating systems. The recommendations can be the basis for selecting the optimum design solution for a lightweight floor heating system.
评估在低高度地板采暖中使用辐射板的有效性
本文探讨了在轻质低高度地板采暖中使用辐射板的可行性。在这种结构中,高热阻的干燥熨平板被带有加强网的低热阻粘合层所取代。在热阻为 0.001 m2K/W 的地板饰面中,如果不使用辐射板,热量输出将减少 5%-17%;在热阻为 0.05 m2K/W 的地板饰面中,热量输出将减少 50%-54%;在热阻为 0.1 m2K/W 的地板饰面中,热量输出将减少 60%-62%。与没有面板的结构(8.8 K)相比,有面板的结构表面温度振幅较低(最大 2.4 K),从而提高了地板使用者的舒适度。我们还确定了安装了所分析结构的建筑物的年供暖成本。在地板饰面电阻分别为 0.001、0.05 和 0.1 m2K/W 的情况下,没有面板的成本分别增加了 13%、37% 和 79%。在地板电阻为 0.001 m2K/W 的情况下,购买辐射板的 SPBT 为 40 年,这表明这种解决方案是无利可图的。地板电阻为 0.05 和 0.1 m2K/W 时,SPBT 分别为 14 年和 6 年。选择地暖系统时应考虑所需的热输出、热舒适度和经济性。本文评估了在低高度地板采暖结构中使用辐射板的有效性,在这种结构中,干燥的地坪层被带有加强网的粘合层所取代。这种结构由于安装快捷、高度低而越来越受欢迎,但缺点是板材成本高。本文评估了面板对热量输出的影响,并确定了在何种条件下使用面板具有经济合理性。结果的接受者是供热系统的设计者和承包商。这些建议可作为选择轻质地板采暖系统最佳设计方案的依据。
本文章由计算机程序翻译,如有差异,请以英文原文为准。
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