{"title":"High Performance Field Emission Cathode based on the Diamond Nanowires Prepared by Nanocrystalline Diamond Films Annealed in Air","authors":"Yang Wang, Chen Lin, Jinwen Zhang","doi":"10.1088/1361-6439/ad1efe","DOIUrl":null,"url":null,"abstract":"\n This paper reports the field emission (FE) characteristics of a diamond nanowires (DNWs) array. The nanocrystalline diamond (NCD) film was deposited on silicon by microwave plasma chemical vapor deposited (MPCVD) and then annealed in air forming DNWs and hydrogenated at last. A high-field flat-plate emission test structure with a 1.03 μm gap between anode and cathode was prepared and the electrical properties proved it feasible. The FE performance of DNWs array was measured in a vacuum test system and that of NCDs film either as a comparison. Finally, their FE parameters were analyzed and extracted based on the Fowler-Nordheim (F-N) theory. The results show that transforming NCDs film into DNWs array can improve the FE characteristics greatly. The turn-on field is as low as 1.36 V/μm dropping by one order of magnitude, while the field enhancement factor and FE current density are up to 156.68 and 484.75 mA/cm2 respectively rising both by two orders of magnitude. This excellent FE performance stems from the characteristics of large aspect ratio, very small tip radius and high density of DNWs.","PeriodicalId":16346,"journal":{"name":"Journal of Micromechanics and Microengineering","volume":null,"pages":null},"PeriodicalIF":2.4000,"publicationDate":"2024-01-16","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"0","resultStr":null,"platform":"Semanticscholar","paperid":null,"PeriodicalName":"Journal of Micromechanics and Microengineering","FirstCategoryId":"5","ListUrlMain":"https://doi.org/10.1088/1361-6439/ad1efe","RegionNum":4,"RegionCategory":"工程技术","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"Q2","JCRName":"ENGINEERING, ELECTRICAL & ELECTRONIC","Score":null,"Total":0}
引用次数: 0
Abstract
This paper reports the field emission (FE) characteristics of a diamond nanowires (DNWs) array. The nanocrystalline diamond (NCD) film was deposited on silicon by microwave plasma chemical vapor deposited (MPCVD) and then annealed in air forming DNWs and hydrogenated at last. A high-field flat-plate emission test structure with a 1.03 μm gap between anode and cathode was prepared and the electrical properties proved it feasible. The FE performance of DNWs array was measured in a vacuum test system and that of NCDs film either as a comparison. Finally, their FE parameters were analyzed and extracted based on the Fowler-Nordheim (F-N) theory. The results show that transforming NCDs film into DNWs array can improve the FE characteristics greatly. The turn-on field is as low as 1.36 V/μm dropping by one order of magnitude, while the field enhancement factor and FE current density are up to 156.68 and 484.75 mA/cm2 respectively rising both by two orders of magnitude. This excellent FE performance stems from the characteristics of large aspect ratio, very small tip radius and high density of DNWs.
期刊介绍:
Journal of Micromechanics and Microengineering (JMM) primarily covers experimental work, however relevant modelling papers are considered where supported by experimental data.
The journal is focussed on all aspects of:
-nano- and micro- mechanical systems
-nano- and micro- electomechanical systems
-nano- and micro- electrical and mechatronic systems
-nano- and micro- engineering
-nano- and micro- scale science
Please note that we do not publish materials papers with no obvious application or link to nano- or micro-engineering.
Below are some examples of the topics that are included within the scope of the journal:
-MEMS and NEMS:
Including sensors, optical MEMS/NEMS, RF MEMS/NEMS, etc.
-Fabrication techniques and manufacturing:
Including micromachining, etching, lithography, deposition, patterning, self-assembly, 3d printing, inkjet printing.
-Packaging and Integration technologies.
-Materials, testing, and reliability.
-Micro- and nano-fluidics:
Including optofluidics, acoustofluidics, droplets, microreactors, organ-on-a-chip.
-Lab-on-a-chip and micro- and nano-total analysis systems.
-Biomedical systems and devices:
Including bio MEMS, biosensors, assays, organ-on-a-chip, drug delivery, cells, biointerfaces.
-Energy and power:
Including power MEMS/NEMS, energy harvesters, actuators, microbatteries.
-Electronics:
Including flexible electronics, wearable electronics, interface electronics.
-Optical systems.
-Robotics.