Numerical Analysis of Fluid Flow and Heat Transfer Characteristics of Novel Microchannel Heat Sink

Yew Wai Loon, Nor azwadi Che Sidik, Yutaka Asako
{"title":"Numerical Analysis of Fluid Flow and Heat Transfer Characteristics of Novel Microchannel Heat Sink","authors":"Yew Wai Loon, Nor azwadi Che Sidik, Yutaka Asako","doi":"10.37934/arnht.15.1.123","DOIUrl":null,"url":null,"abstract":"Microchannel heat sinks have gained prominence in the field of thermal management, offering compact and efficient solutions for dissipating heat flux from high performance electronic devices. Escalating heat flux in modern electronic devices, such as those found in telecommunication equipment, industrial automation equipment, solar devices, and data centre servers has driven the continuous development of microchannel heat sink to achieve efficient thermal management. The critical challenge in thermal management for these devices is to develop a microchannel that enhances heat transfer performance and minimises pressure drop. Heat transfer and pressure drop are two competing factors that determine the practicability of the design for real world application. Improvement in heat transfer performance usually results in an increase in pressure drop and pumping power. This study addresses the challenges of designing microchannel through comprehensive numerical analysis of fluid flow and heat transfer characteristics of a novel design that combines ribs, secondary channels, and tertiary channels. The numerical results showed that the novel microchannel design achieves a favourable balance between heat transfer and pressure drop, demonstrating its potential to be used in application where high heat transfer and efficiency are paramount. To assess the performance of the microchannels, thermal resistance, a measure of system’s resistance to heat transfer is used. At the same pumping power, thermal resistance in the new design is consistently lower compared to other designs.","PeriodicalId":119773,"journal":{"name":"Journal of Advanced Research in Numerical Heat Transfer","volume":null,"pages":null},"PeriodicalIF":0.0000,"publicationDate":"2024-01-21","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"0","resultStr":null,"platform":"Semanticscholar","paperid":null,"PeriodicalName":"Journal of Advanced Research in Numerical Heat Transfer","FirstCategoryId":"1085","ListUrlMain":"https://doi.org/10.37934/arnht.15.1.123","RegionNum":0,"RegionCategory":null,"ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"","JCRName":"","Score":null,"Total":0}
引用次数: 0

Abstract

Microchannel heat sinks have gained prominence in the field of thermal management, offering compact and efficient solutions for dissipating heat flux from high performance electronic devices. Escalating heat flux in modern electronic devices, such as those found in telecommunication equipment, industrial automation equipment, solar devices, and data centre servers has driven the continuous development of microchannel heat sink to achieve efficient thermal management. The critical challenge in thermal management for these devices is to develop a microchannel that enhances heat transfer performance and minimises pressure drop. Heat transfer and pressure drop are two competing factors that determine the practicability of the design for real world application. Improvement in heat transfer performance usually results in an increase in pressure drop and pumping power. This study addresses the challenges of designing microchannel through comprehensive numerical analysis of fluid flow and heat transfer characteristics of a novel design that combines ribs, secondary channels, and tertiary channels. The numerical results showed that the novel microchannel design achieves a favourable balance between heat transfer and pressure drop, demonstrating its potential to be used in application where high heat transfer and efficiency are paramount. To assess the performance of the microchannels, thermal resistance, a measure of system’s resistance to heat transfer is used. At the same pumping power, thermal resistance in the new design is consistently lower compared to other designs.
新型微通道散热器的流体流动和传热特性的数值分析
微通道散热器为高性能电子设备提供了紧凑高效的散热解决方案,在热管理领域大放异彩。现代电子设备(如电信设备、工业自动化设备、太阳能设备和数据中心服务器中的设备)的热通量不断增加,推动了微通道散热器的不断发展,以实现高效的热管理。这些设备在热管理方面面临的关键挑战是开发一种既能提高传热性能又能最大限度减少压降的微通道。传热和压降是两个相互竞争的因素,决定了设计在实际应用中的实用性。传热性能的提高通常会导致压降和泵功率的增加。本研究通过对结合了肋片、二级通道和三级通道的新型设计的流体流动和传热特性进行全面的数值分析,解决了微通道设计所面临的挑战。数值结果表明,这种新型微通道设计在传热和压降之间实现了良好的平衡,证明了其在对传热和效率要求较高的应用中的应用潜力。为了评估微通道的性能,采用了热阻这一衡量系统传热阻力的指标。在相同的泵功率下,新设计的热阻始终低于其他设计。
本文章由计算机程序翻译,如有差异,请以英文原文为准。
求助全文
约1分钟内获得全文 求助全文
来源期刊
CiteScore
6.20
自引率
0.00%
发文量
0
×
引用
GB/T 7714-2015
复制
MLA
复制
APA
复制
导出至
BibTeX EndNote RefMan NoteFirst NoteExpress
×
提示
您的信息不完整,为了账户安全,请先补充。
现在去补充
×
提示
您因"违规操作"
具体请查看互助需知
我知道了
×
提示
确定
请完成安全验证×
copy
已复制链接
快去分享给好友吧!
我知道了
右上角分享
点击右上角分享
0
联系我们:info@booksci.cn Book学术提供免费学术资源搜索服务,方便国内外学者检索中英文文献。致力于提供最便捷和优质的服务体验。 Copyright © 2023 布克学术 All rights reserved.
京ICP备2023020795号-1
ghs 京公网安备 11010802042870号
Book学术文献互助
Book学术文献互助群
群 号:481959085
Book学术官方微信