Numerical investigations of water jet-guided laser cutting of silicon

IF 1.7 4区工程技术 Q3 MATERIALS SCIENCE, MULTIDISCIPLINARY

Journal of Laser Applications Pub Date : 2024-01-22 DOI:10.2351/7.0001268

Hui Jiao, Qingyuan Liu, Guanghui Zhang, Ze Lin, Jia Zhou, Yuxing Huang, Yuhong Long

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Abstract

To investigate the interaction mechanism between a laser, water jet, and substrate, a model is developed to simulate the temperature field evolution and removal process during water jet-guided laser (WJGL) cutting of silicon. The model accounted for the temperature-dependent properties of the silicon absorption coefficient, as well as the physical processes of solid-liquid-gas phase change. A three-dimensional finite volume model of WJGL cutting of silicon is created, incorporating laser energy input, water jet impact-cooling, and silicon phase transition and removal. The volume of fluid (VOF) method is employed to trace the interphase interface and obtain the groove shape. The validity of the model is verified by comparing simulation results with experimental data. The simulation results show that the groove cross section is characterized by a “V” shape. The groove depth nonlinearly increases from 52 to 385 μm with an increasing number of cuts. Additionally, the residual temperature of the silicon substrate rises from 837 to 1345 K as the number of scans increases from 1 to 10. The findings offer valuable insights into WJGL cutting research, specifically shedding light on the intricate details of the laser-water jet-substrate interaction mechanism.

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水射流引导激光切割硅的数值研究

为了研究激光、水射流和基片之间的相互作用机制，我们建立了一个模型来模拟水射流制导激光（WJGL）切割硅时的温度场演变和去除过程。该模型考虑了硅吸收系数随温度变化的特性，以及固-液-气相变的物理过程。创建了一个 WJGL 切割硅的三维有限体积模型，其中包括激光能量输入、水射流冲击冷却以及硅的相变和去除。采用流体体积（VOF）方法跟踪相间界面并获得沟槽形状。通过比较模拟结果和实验数据，验证了模型的有效性。模拟结果表明，沟槽横截面呈 "V "形。随着切割次数的增加，沟槽深度从 52 微米非线性地增加到 385 微米。此外，随着扫描次数从 1 次增加到 10 次，硅衬底的残余温度从 837 K 上升到 1345 K。这些发现为 WJGL 切割研究提供了宝贵的见解，特别是揭示了激光-水射流-基底相互作用机制的复杂细节。

本文章由计算机程序翻译，如有差异，请以英文原文为准。

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来源期刊

Journal of Laser Applications 物理-光学

CiteScore

3.60

自引率

9.50%

发文量

125

审稿时长

>12 weeks

期刊介绍： The Journal of Laser Applications (JLA) is the scientific platform of the Laser Institute of America (LIA) and is published in cooperation with AIP Publishing. The high-quality articles cover a broad range from fundamental and applied research and development to industrial applications. Therefore, JLA is a reflection of the state-of-R&D in photonic production, sensing and measurement as well as Laser safety. The following international and well known first-class scientists serve as allocated Editors in 9 new categories: High Precision Materials Processing with Ultrafast Lasers Laser Additive Manufacturing High Power Materials Processing with High Brightness Lasers Emerging Applications of Laser Technologies in High-performance/Multi-function Materials and Structures Surface Modification Lasers in Nanomanufacturing / Nanophotonics & Thin Film Technology Spectroscopy / Imaging / Diagnostics / Measurements Laser Systems and Markets Medical Applications & Safety Thermal Transportation Nanomaterials and Nanoprocessing Laser applications in Microelectronics.