Effect of bonding temperature on microstructure and properties of TLP joined Q355 steel with Cu interlayer

IF 2.4 4区材料科学 Q2 MATERIALS SCIENCE, CHARACTERIZATION & TESTING

Materials Testing Pub Date : 2024-01-29 DOI:10.1515/mt-2023-0371

Bensheng Huang, Peng Tang, Chunyan Ju, Peng Chen, Wenzhu Shen, Hanyang Zuo

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引用次数: 0

Abstract

Q355 steel with Cu interlayer was bonded by transient liquid phase diffusion bonding (TLP-DB) at different bonding temperatures, and good bonding joints were obtained. The joints were characterized by optical microscopy, scanning electron microscopy and mechanical properties. The results show that there is a bending phenomenon caused by the difference of element diffusion at the bonding interface at the bonding temperature of 1050 °C. With the increase of the bonding temperature, the diffusion of Cu element plays a role in refining the grain, but with the increase of the bonding temperature, it will also lead to the overgrowth of the grain; At the bonding temperature of 1050 °C, there are obvious mutations in the diffusion of Cu and Fe elements, but the increase of the bonding temperature has a good effect on the interdiffusion of the elements. The mechanical properties test showed that with the increase of the bonding temperature, the hardness, shear strength, and impact toughness at the center of the joint increased first and then decreased, and all reached the maximum at 1100 °C. The electrochemical performance test showed that with the increase of temperature, the corrosion resistance of the joint also increased first and then decreased.

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粘接温度对含铜夹层的 TLP 接合 Q355 钢微观结构和性能的影响

在不同的粘接温度下，采用瞬态液相扩散粘接（TLP-DB）技术粘接了带有铜夹层的 Q355 钢，并获得了良好的粘接接头。通过光学显微镜、扫描电子显微镜和机械性能对接头进行了表征。结果表明，在 1050 ℃ 的粘合温度下，由于元素在粘合界面扩散的差异，会出现弯曲现象。随着结合温度的升高，Cu 元素的扩散起到了细化晶粒的作用，但随着结合温度的升高，也会导致晶粒的过度生长；在结合温度为 1050 ℃ 时，Cu 和 Fe 元素的扩散存在明显的突变，但结合温度的升高对元素的相互扩散有良好的影响。力学性能测试表明，随着结合温度的升高，接头中心的硬度、剪切强度和冲击韧性先升高后降低，在 1100 ℃ 时均达到最大值。电化学性能测试表明，随着温度的升高，接头的耐腐蚀性能也是先升高后降低。

本文章由计算机程序翻译，如有差异，请以英文原文为准。

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来源期刊

Materials Testing 工程技术-材料科学：表征与测试

CiteScore

4.20

自引率

36.00%

发文量

165

审稿时长

4-8 weeks

期刊介绍： Materials Testing is a SCI-listed English language journal dealing with all aspects of material and component testing with a special focus on transfer between laboratory research into industrial application. The journal provides first-hand information on non-destructive, destructive, optical, physical and chemical test procedures. It contains exclusive articles which are peer-reviewed applying respectively high international quality criterions.