Enhancing the bond strength of magnetron-sputtered copper layers on polyimide and polyether ether ketone surfaces through surface modification

IF 2.7 4区材料科学 Q3 ENGINEERING, CHEMICAL

Journal of Adhesion Science and Technology Pub Date : 2024-01-11 DOI:10.1080/01694243.2024.2302250

Ruijun Wang, Puren Liu, Jingbo Liu, Tianshi Wang, Xiaolu Pang, Lining Xu, Lijie Qiao

引用次数: 0

Abstract

This study explores the fabrication of composites involving polyimide (PI) and polyether ether ketone (PEEK) resins with Cu using chemical treatment and sandblasting, followed by plasma cleaning in...

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通过表面改性提高聚酰亚胺和聚醚醚酮表面磁控溅射铜层的结合强度

本研究探讨了在聚酰亚胺 (PI) 和聚醚醚酮 (PEEK) 树脂与铜的复合材料中，使用化学处理和喷砂，然后在...

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来源期刊

Journal of Adhesion Science and Technology 工程技术-材料科学：综合

CiteScore

5.10

自引率

13.00%

发文量

136

审稿时长

4.1 months

期刊介绍： Journal of Adhesion Science and Technology ( JAST) provides a forum for the basic and applied aspects of adhesion, chemistry of adhesives, coatings and sealants, and structure-properties relationships in adhesive joints and deals with applications of adhesion principles in all areas of technology.