Universal Chiplet Interconnect Express: An Open Industry Standard for Memory and Storage Applications

IF 2 4区 计算机科学 Q3 COMPUTER SCIENCE, HARDWARE & ARCHITECTURE
Computer Pub Date : 2024-01-01 DOI:10.1109/mc.2023.3318769
Debendra Das Sharma, Thomas Coughlin
{"title":"Universal Chiplet Interconnect Express: An Open Industry Standard for Memory and Storage Applications","authors":"Debendra Das Sharma, Thomas Coughlin","doi":"10.1109/mc.2023.3318769","DOIUrl":null,"url":null,"abstract":"","PeriodicalId":10623,"journal":{"name":"Computer","volume":" 14","pages":""},"PeriodicalIF":2.0000,"publicationDate":"2024-01-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"0","resultStr":null,"platform":"Semanticscholar","paperid":null,"PeriodicalName":"Computer","FirstCategoryId":"94","ListUrlMain":"https://doi.org/10.1109/mc.2023.3318769","RegionNum":4,"RegionCategory":"计算机科学","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"Q3","JCRName":"COMPUTER SCIENCE, HARDWARE & ARCHITECTURE","Score":null,"Total":0}
引用次数: 0
通用芯片组互连 Express:内存和存储应用的开放式行业标准
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来源期刊
Computer
Computer 工程技术-计算机:软件工程
CiteScore
3.90
自引率
4.50%
发文量
378
审稿时长
12 months
期刊介绍: Computer, the flagship publication of the IEEE Computer Society, publishes peer-reviewed articles written for and by computer researchers and practitioners representing the full spectrum of computing and information technology, from hardware to software and from emerging research to new applications. The aim is to provide more technical substance than trade magazines and more practical ideas than research journals. Computer seeks to deliver useful information for all computing professionals and students, including computer scientists, engineers, and practitioners of all levels.
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