Manu Garg, D. S. Arya, Sushil Kumar, Khanjan Joshi, M. Yousuf, Yi-Yen Chiu, PUSHPAPRAJ SINGH
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引用次数: 0
Abstract
An electrostatically actuated all-metal MEMS Pirani gauge with a tunable dynamic range is proposed. Contrary to the conventional fixed gap Pirani gauges, an electrostatic mechanism is employed to tune the gaseous conduction gap. Due to the electrostatic force between the heating element and heat sink, this tuning results in shifting the transition pressure to a higher pressure. As a result, the operating range of the Pirani gauge can be tuned depending on the magnitude of the actuation voltage. Theoretical estimation of the transition pressure corresponding to different gaseous conduction gaps is also presented. Depending on the available margin of gap tuning, the electromechanical and electrothermal analyses are carried out in COMSOL Multiphysics. The analytical approach is validated by experimentally characterizing the fabricated device. The experimentally tested device with the proposed actuation mechanism shows an 11.2 dB increase in dynamic range in comparison to the conventional design. In a CMOS-compatible fabrication process flow, the proposed gauge can be used to monitor vacuum from 40 Pa to 5×10^5 Pa with the electrostatic actuation.
期刊介绍:
Journal of Micromechanics and Microengineering (JMM) primarily covers experimental work, however relevant modelling papers are considered where supported by experimental data.
The journal is focussed on all aspects of:
-nano- and micro- mechanical systems
-nano- and micro- electomechanical systems
-nano- and micro- electrical and mechatronic systems
-nano- and micro- engineering
-nano- and micro- scale science
Please note that we do not publish materials papers with no obvious application or link to nano- or micro-engineering.
Below are some examples of the topics that are included within the scope of the journal:
-MEMS and NEMS:
Including sensors, optical MEMS/NEMS, RF MEMS/NEMS, etc.
-Fabrication techniques and manufacturing:
Including micromachining, etching, lithography, deposition, patterning, self-assembly, 3d printing, inkjet printing.
-Packaging and Integration technologies.
-Materials, testing, and reliability.
-Micro- and nano-fluidics:
Including optofluidics, acoustofluidics, droplets, microreactors, organ-on-a-chip.
-Lab-on-a-chip and micro- and nano-total analysis systems.
-Biomedical systems and devices:
Including bio MEMS, biosensors, assays, organ-on-a-chip, drug delivery, cells, biointerfaces.
-Energy and power:
Including power MEMS/NEMS, energy harvesters, actuators, microbatteries.
-Electronics:
Including flexible electronics, wearable electronics, interface electronics.
-Optical systems.
-Robotics.