Epoxy-Based Siloxane/Silica Composites for Electronic Packaging by Composition and Molecular Structure of Siloxane, and Analysis of Changes in Properties
{"title":"Epoxy-Based Siloxane/Silica Composites for Electronic Packaging by Composition and Molecular Structure of Siloxane, and Analysis of Changes in Properties","authors":"Junho Jang, Dong Jun Kang, Hyeon-Gyun Im","doi":"10.4150/kpmi.2023.30.4.346","DOIUrl":null,"url":null,"abstract":"","PeriodicalId":16122,"journal":{"name":"Journal of Korean Powder Metallurgy Institute","volume":"30 1","pages":""},"PeriodicalIF":0.0000,"publicationDate":"2023-08-30","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"0","resultStr":null,"platform":"Semanticscholar","paperid":null,"PeriodicalName":"Journal of Korean Powder Metallurgy Institute","FirstCategoryId":"1085","ListUrlMain":"https://doi.org/10.4150/kpmi.2023.30.4.346","RegionNum":0,"RegionCategory":null,"ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"","JCRName":"","Score":null,"Total":0}
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