Numerical Simulation of Tantalum Capacitor Reflow Soldering in Temperature Field

Abstract

This article aims to simulate and design the thermal stress during the welding process of tantalum capacitors, which is prone to failure. In this paper, the subsection function is defined, the boundary conditions of thermal stress are set, and the mesh is divided through the temperature diagram of high temperature reflow welding process; Analyze the temperature changes in the welding machine based on time changes, and conduct simulation analysis of thermal stress and cross-sectional analysis of thermal stress. Through simulation results, improve the design structure to minimize the impact of welding process on capacitor failure.