Developing a Monitoring System for Wire Bonders Using Semiconductor Equipment and Materials International (SEMI) Equipment Communications Standard Sensors

IF 1 4区材料科学 Q4 INSTRUMENTS & INSTRUMENTATION

Sensors and Materials Pub Date : 2023-11-17 DOI:10.18494/sam4643

Ying-Chieh Liu, Feng-Chia Li

引用次数: 0

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利用国际半导体设备与材料协会（SEMI）设备通信标准传感器开发焊线监测系统

本文章由计算机程序翻译，如有差异，请以英文原文为准。

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来源期刊

Sensors and Materials 工程技术-材料科学：综合

CiteScore

2.00

自引率

33.30%

发文量

294

审稿时长

3 months

期刊介绍： Sensors and Materials is designed to provide a forum for people working in the multidisciplinary fields of sensing technology, and publishes contributions describing original work in the experimental and theoretical fields, aimed at understanding sensing technology, related materials, associated phenomena, and applied systems. Expository review papers and short notes are also acceptable.