Huda M. J. Ali, Ahmed Q. Abdullah, Zainab J. Shanan
{"title":"Environmentally Friendly Wood Adhesives Based on Dextrin/Arabic Gum Blends","authors":"Huda M. J. Ali, Ahmed Q. Abdullah, Zainab J. Shanan","doi":"10.53523/ijoirvol10i3id356","DOIUrl":null,"url":null,"abstract":"Wood adhesives are widely used consisting of urea-formaldehyde resins. Most of the studies aim to find alternative natural materials to replace the carcinogenic chemical adhesives. A mixture of natural materials that are available in abundance, cheap in price and are resistant to water and heat, the failure of the interface between two solid dielectrics is a major source of insulation system failure, hence it is crucial to understand the principles regulating this breakdown occurrence. It is generally agreed that the tangential AC breakdown strength of solid-solid surfaces is primarily determined by the elastic modulus (elasticity), radial/tangential pressure, surface smoothness/roughness, and dielectric strength of the ambient environment. For this purpose, we made use of dextrin and Arabic gum. Physical parameters (Lap shear strength, pull off strength, hardness, roughness, electrical and thermal insulations) of the combination formed with varying amounts of each ingredient were investigated. The adhesive characteristics of D were enhanced by the incorporation of AG, with improved pull off adhesion and lap shear strength at increasing AG levels at 80%. D /AG 20/80 compositions had pull off adhesion values 189 times greater than pure D, and lap shear strength values 820 times higher. It is evident because of the dispersion of AG molecules in decreasing the surface roughness of D/AG films and increasing their hardness on the shore scale. There is a positive correlation between the amount of AG added and the blending matrix of D, therefore boosting A with AG increases A. The dielectric strength, and thermal insulation increases with the increase in the weight ratio of Arabic gum. The blend prepared as an adhesive for wood is a good electrical and thermal insulator at 8% AG/20% D.","PeriodicalId":14665,"journal":{"name":"Iraqi Journal of Industrial Research","volume":"11 3","pages":""},"PeriodicalIF":0.0000,"publicationDate":"2023-12-14","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"0","resultStr":null,"platform":"Semanticscholar","paperid":null,"PeriodicalName":"Iraqi Journal of Industrial Research","FirstCategoryId":"1085","ListUrlMain":"https://doi.org/10.53523/ijoirvol10i3id356","RegionNum":0,"RegionCategory":null,"ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"","JCRName":"","Score":null,"Total":0}
引用次数: 0
Abstract
Wood adhesives are widely used consisting of urea-formaldehyde resins. Most of the studies aim to find alternative natural materials to replace the carcinogenic chemical adhesives. A mixture of natural materials that are available in abundance, cheap in price and are resistant to water and heat, the failure of the interface between two solid dielectrics is a major source of insulation system failure, hence it is crucial to understand the principles regulating this breakdown occurrence. It is generally agreed that the tangential AC breakdown strength of solid-solid surfaces is primarily determined by the elastic modulus (elasticity), radial/tangential pressure, surface smoothness/roughness, and dielectric strength of the ambient environment. For this purpose, we made use of dextrin and Arabic gum. Physical parameters (Lap shear strength, pull off strength, hardness, roughness, electrical and thermal insulations) of the combination formed with varying amounts of each ingredient were investigated. The adhesive characteristics of D were enhanced by the incorporation of AG, with improved pull off adhesion and lap shear strength at increasing AG levels at 80%. D /AG 20/80 compositions had pull off adhesion values 189 times greater than pure D, and lap shear strength values 820 times higher. It is evident because of the dispersion of AG molecules in decreasing the surface roughness of D/AG films and increasing their hardness on the shore scale. There is a positive correlation between the amount of AG added and the blending matrix of D, therefore boosting A with AG increases A. The dielectric strength, and thermal insulation increases with the increase in the weight ratio of Arabic gum. The blend prepared as an adhesive for wood is a good electrical and thermal insulator at 8% AG/20% D.
广泛使用的木材粘合剂包括脲醛树脂。大多数研究旨在寻找替代天然材料,以取代致癌的化学粘合剂。两种固体电介质之间的界面失效是绝缘系统失效的一个主要原因,因此了解发生这种击穿的原理至关重要。一般认为,固体-固体表面的切向交流击穿强度主要取决于弹性模量(弹性)、径向/切向压力、表面光滑度/通透度以及周围环境的介电强度。为此,我们使用了糊精和阿拉伯胶。研究了每种成分的不同用量所形成的组合物的物理参数(拉普剪切强度、拉断强度、硬度、粗糙度、电绝缘性和热绝缘性)。加入 AG 后,D 的粘合特性得到了增强,当 AG 含量增加到 80% 时,拉离粘合力和搭接剪切强度都有所提高。D /AG 20/80 复合物的拉断粘附力值是纯 D 的 189 倍,搭接剪切强度值是纯 D 的 820 倍。这显然是因为 AG 分子的分散降低了 D/AG 薄膜的表面粗糙度,提高了其邵氏硬度。添加的 AG 量与 D 的混合基质呈正相关,因此用 AG 增加 A 会增加 A。在 AG 含量为 8%/20% D 的情况下,作为木材粘合剂制备的混合物具有良好的电绝缘性和热绝缘性。