Particle-in-cell simulations of high frequency capacitively coupled plasmas including spatially localised inductive-like heating

M Osca Engelbrecht, C P Ridgers, J Dedrick, R Boswell
{"title":"Particle-in-cell simulations of high frequency capacitively coupled plasmas including spatially localised inductive-like heating","authors":"M Osca Engelbrecht, C P Ridgers, J Dedrick, R Boswell","doi":"10.1088/1361-6595/ad0fb1","DOIUrl":null,"url":null,"abstract":"High frequency (HF) capacitively coupled plasmas (CCPs) are ubiquitous, having several industrial applications, especially in the semiconductor industry. Inductive heating effects within these plasmas play an important role and therefore understanding them is key to improve industrial applications. For this purpose kinetic research, using particle-in-cell (PIC) codes, offers significant opportunity to study, and improve, industrial plasma processes that operate at the atomic level. However, PIC codes commonly used for CCPs are electrostatic and thus cannot be used to simulate electromagnetically induced currents. Therefore we have developed EPOCH-LTP, a 1D PIC code with a current heating model, that enables the simulation of inductive heating effects in HF CCPs. First simulation results, from an HF CCP (60 MHz) operated at 1 mTorr of argon, show that inductive currents couple most of their power to the electrons at the interface between the bulk plasma and the sheath. Furthermore, the simulation of a dual-frequency CCP, where a HF inductive current and a low-frequency (LF) voltage waveform at 400 kHz are applied, have shown a synergy between the HF and LF waveforms that increase the inductive heating rate.","PeriodicalId":20192,"journal":{"name":"Plasma Sources Science and Technology","volume":"197 1","pages":""},"PeriodicalIF":0.0000,"publicationDate":"2023-12-07","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"0","resultStr":null,"platform":"Semanticscholar","paperid":null,"PeriodicalName":"Plasma Sources Science and Technology","FirstCategoryId":"1085","ListUrlMain":"https://doi.org/10.1088/1361-6595/ad0fb1","RegionNum":0,"RegionCategory":null,"ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"","JCRName":"","Score":null,"Total":0}
引用次数: 0

Abstract

High frequency (HF) capacitively coupled plasmas (CCPs) are ubiquitous, having several industrial applications, especially in the semiconductor industry. Inductive heating effects within these plasmas play an important role and therefore understanding them is key to improve industrial applications. For this purpose kinetic research, using particle-in-cell (PIC) codes, offers significant opportunity to study, and improve, industrial plasma processes that operate at the atomic level. However, PIC codes commonly used for CCPs are electrostatic and thus cannot be used to simulate electromagnetically induced currents. Therefore we have developed EPOCH-LTP, a 1D PIC code with a current heating model, that enables the simulation of inductive heating effects in HF CCPs. First simulation results, from an HF CCP (60 MHz) operated at 1 mTorr of argon, show that inductive currents couple most of their power to the electrons at the interface between the bulk plasma and the sheath. Furthermore, the simulation of a dual-frequency CCP, where a HF inductive current and a low-frequency (LF) voltage waveform at 400 kHz are applied, have shown a synergy between the HF and LF waveforms that increase the inductive heating rate.
高频电容耦合等离子体(包括空间局域电感式加热)的粒子间模拟
高频(HF)电容耦合等离子体(CCPs)无处不在,有多种工业应用,尤其是在半导体行业。这些等离子体中的感应加热效应发挥着重要作用,因此了解这些效应是改进工业应用的关键。为此,使用粒子在胞(PIC)代码进行动力学研究,为研究和改进在原子水平上运行的工业等离子体过程提供了重要机会。然而,常用于 CCP 的 PIC 代码是静电式的,因此不能用于模拟电磁感应电流。因此,我们开发了 EPOCH-LTP,这是一种带有电流加热模型的一维 PIC 代码,可以模拟高频 CCP 中的感应加热效应。在 1 mTorr 的氩气条件下运行的高频 CCP(60 MHz)的首次模拟结果表明,感应电流将其大部分功率耦合到了大块等离子体和鞘之间界面的电子上。此外,对双频 CCP(施加高频感应电流和 400 kHz 的低频(LF)电压波形)的模拟显示,高频和低频波形之间的协同作用提高了感应加热率。
本文章由计算机程序翻译,如有差异,请以英文原文为准。
求助全文
约1分钟内获得全文 求助全文
来源期刊
自引率
0.00%
发文量
0
×
引用
GB/T 7714-2015
复制
MLA
复制
APA
复制
导出至
BibTeX EndNote RefMan NoteFirst NoteExpress
×
提示
您的信息不完整,为了账户安全,请先补充。
现在去补充
×
提示
您因"违规操作"
具体请查看互助需知
我知道了
×
提示
确定
请完成安全验证×
copy
已复制链接
快去分享给好友吧!
我知道了
右上角分享
点击右上角分享
0
联系我们:info@booksci.cn Book学术提供免费学术资源搜索服务,方便国内外学者检索中英文文献。致力于提供最便捷和优质的服务体验。 Copyright © 2023 布克学术 All rights reserved.
京ICP备2023020795号-1
ghs 京公网安备 11010802042870号
Book学术文献互助
Book学术文献互助群
群 号:481959085
Book学术官方微信