Investigation on tensile strength of CMT and P-CMT joints of AA8011 aluminum alloy

IF 1.3 4区材料科学 Q4 MATERIALS SCIENCE, MULTIDISCIPLINARY

Emerging Materials Research Pub Date : 2023-12-01 DOI:10.1680/jemmr.23.00102

R. Sasidharan, C. Rajendran, Tushar Sonar, Mikhail Ivanov

引用次数: 0

Abstract

The advanced variant of gas metal arc welding (GMAW) known as cold metal transfer (CMT) developed by Fronius in Austria is used to overcome the heat input and fusion related issues such as porosity and cracking in welding of AA8011-H18 alloy sheets. The 3 mm thick sheets of AA8011-H18 alloy were welded using normal CMT-GMAW and pulsed CMT (PCMT-GMAW) processes. The microstructure of weld metal (WM) and heat affected zone (HAZ) was analysed using optical microscope. The tensile properties and hardness of joints were evaluated and compared. Results revealed that the PCMT-GMAW joints showed 26.45%, 48.97% and 40.42% improvement in tensile strength, yield strength and elongation compared to CMT-GMAW joints. The superior tensile performance of PCMT-GMAW joints compared to CMT-GMAW joints is due to the current pulsing effects along with wire retraction mechanism which aids in reducing the heat input and controlled droplet transfer.

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关于 AA8011 铝合金 CMT 和 P-CMT 接头拉伸强度的研究

奥地利的Fronius公司开发了一种先进的气体金属电弧焊(GMAW)，即冷金属转移(CMT)，用于克服AA8011-H18合金板材焊接中的热输入和熔化相关问题，如气孔和开裂。采用常规CMT- gmaw和脉冲CMT (PCMT-GMAW)工艺焊接3mm厚的AA8011-H18合金板材。利用光学显微镜对焊缝金属(WM)和热影响区(HAZ)的显微组织进行了分析。对接头的拉伸性能和硬度进行了评价和比较。结果表明，PCMT-GMAW接头的抗拉强度、屈服强度和伸长率分别比CMT-GMAW接头提高了26.45%、48.97%和40.42%。与CMT-GMAW接头相比，PCMT-GMAW接头优越的拉伸性能是由于电流脉冲效应和金属丝收缩机制，有助于减少热量输入和控制液滴传递。

本文章由计算机程序翻译，如有差异，请以英文原文为准。

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来源期刊

Emerging Materials Research MATERIALS SCIENCE, MULTIDISCIPLINARY-

CiteScore

4.50

自引率

9.10%

发文量

期刊介绍： Materials Research is constantly evolving and correlations between process, structure, properties and performance which are application specific require expert understanding at the macro-, micro- and nano-scale. The ability to intelligently manipulate material properties and tailor them for desired applications is of constant interest and challenge within universities, national labs and industry.