Cold Plate Cooling Investigation for High-Speed Electronic Interconnect

IF 1.6 4区工程技术 Q3 ENGINEERING, MECHANICAL

Heat Transfer Engineering Pub Date : 2023-11-30 DOI:10.1080/01457632.2023.2289229

Taolue Zhang, Nabhanshul Satra, Shailesh Ozarkar, Peerouz Amleshi

引用次数: 0

Abstract

Power dissipation of Quad Small Form-factor Pluggable-Double Density (QSFP-DD) interconnect system is increasing almost linearly with respect to the data speed. Fan cooling solution, which was conv...

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高速电子互连冷板冷却研究

四元小尺寸可插拔双密度(QSFP-DD)互连系统的功耗几乎随数据传输速度呈线性增长。风扇冷却解决方案，这是转换…

本文章由计算机程序翻译，如有差异，请以英文原文为准。

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来源期刊

Heat Transfer Engineering 工程技术-工程：机械

CiteScore

4.50

自引率

17.40%

发文量

111

审稿时长

7.5 months

期刊介绍： Publishing 18 issues per year, Heat Transfer Engineering is an unparalleled resource for key advances in the field of heat transfer for the practicing engineer and other workers in the field. The journal publishes analytical, numerical, and experimental articles of lasting interest in the general area of heat-mass transfer and the related fluid mechanics and thermodynamics. In a clear, easy-to-read format, the journal includes refereed papers of original work, state-of-the-art reviews, articles on new developments in equipment or practices, reviews of fundamentals, heat in history articles, book reviews, news items on people and companies in the field, advertising, and any other items that may be appropriate. All submitted manuscripts are subject to initial appraisal by the Editor and/or selected members of the Editorial Board, and, if found suitable for further consideration, to peer review by independent, anonymous expert referees.