Gaurav Anand, Samira Safaripour, Jaynie Tercovich, Jenna Capozzi, Mark Griffin, Nathan Schin, Nicholas Mirra, Craig Snoeyink
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引用次数: 1
Abstract
Abstract A simple and robust electrode insulation technique that can withstand a voltage as high as 1000V , which is equivalent to an electric field strength of ∼1 MV m −1 across a 10μm channel filled with an electrolyte of conductivity ∼0.1 S m −1 , i.e. higher than sea water’s conductivity, is introduced. A multi-dielectric layers approach is adopted to fabricate the blocked electrodes, which helps reduce the number of material defects. Dielectric insulation with an exceptional breakdown electric field strength for an electrolyte confined between electrodes can have a wide range of applications in microfluidics, like high electric field strength-based dielectrophoresis. The voltage-current characteristics are studied for various concentrations of sodium chloride solution to estimate the insulation strength of the proposed materials, and the breakdown strength is calculated at the point where the electrical insulation failed. A detailed adhesion technique is also demonstrated, which will reduce the ambiguity around the fabrication of a sealed channel using SU-8.
期刊介绍:
Journal of Micromechanics and Microengineering (JMM) primarily covers experimental work, however relevant modelling papers are considered where supported by experimental data.
The journal is focussed on all aspects of:
-nano- and micro- mechanical systems
-nano- and micro- electomechanical systems
-nano- and micro- electrical and mechatronic systems
-nano- and micro- engineering
-nano- and micro- scale science
Please note that we do not publish materials papers with no obvious application or link to nano- or micro-engineering.
Below are some examples of the topics that are included within the scope of the journal:
-MEMS and NEMS:
Including sensors, optical MEMS/NEMS, RF MEMS/NEMS, etc.
-Fabrication techniques and manufacturing:
Including micromachining, etching, lithography, deposition, patterning, self-assembly, 3d printing, inkjet printing.
-Packaging and Integration technologies.
-Materials, testing, and reliability.
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Including optofluidics, acoustofluidics, droplets, microreactors, organ-on-a-chip.
-Lab-on-a-chip and micro- and nano-total analysis systems.
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Including bio MEMS, biosensors, assays, organ-on-a-chip, drug delivery, cells, biointerfaces.
-Energy and power:
Including power MEMS/NEMS, energy harvesters, actuators, microbatteries.
-Electronics:
Including flexible electronics, wearable electronics, interface electronics.
-Optical systems.
-Robotics.