Development of Multi-depth Probing 3D Microelectrode Array to Record Electrophysiological Activity within Neural Cultures

IF 2.4 4区 工程技术 Q2 ENGINEERING, ELECTRICAL & ELECTRONIC
Neeraj Yadav, Donatella Di Lisa, Flavio Giacomozzi, Alessandro Cian, Damiano Giubertoni, Sergio Martinoia, Leandro Lorenzelli
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Abstract

Abstract Microelectrode arrays (MEAs) play a crucial role in investigating the electrophysiological activities of neuronal populations. Although two-dimensional neuronal cell cultures have predominated in neurophysiology in monitoring in-vitro the electrophysiological activity, recent research shifted toward culture using three-dimensional (3D) neuronal network structures for developing more sophisticated and realistic neuronal models. Nevertheless, many challenges remain in the electrophysiological analysis of 3D neuron cultures, among them the development of robust platforms for investigating the electrophysiological signal at multiple depths of the 3D neurons’ networks. While various 3D MEAs have been developed to probe specific depths within the layered nervous system, the fabrication of microelectrodes with different heights, capable of probing neural activity from the surface as well as from the different layers within the neural construct, remains challenging. This study presents a novel 3D MEA with microelectrodes of different heights, realized through a multi-stage mold-assisted electrodeposition process. Our pioneering platform allows meticulous control over the height of individual microelectrodes as well as the array topology, paving the way for the fabrication of 3D MEAs consisting of electrodes with multiple heights that could be tailored for specific applications and experiments. The device performance was characterized by measuring electrochemical impedance, and noise, and capturing spontaneous electrophysiological activity from neurospheroids derived from human induced pluripotent stem cells. These evaluations unequivocally validated the significant potential of our innovative multi-height 3D MEA as an avant-garde platform for in vitro 3D neuronal studies.
多深度探测三维微电极阵列记录神经培养物内电生理活动的研制
微电极阵列(MEAs)在研究神经元群的电生理活动中起着至关重要的作用。尽管二维神经元细胞培养在体外监测神经生理学电生理活动方面占主导地位,但最近的研究转向使用三维(3D)神经元网络结构培养,以开发更复杂和逼真的神经元模型。然而,在3D神经元培养物的电生理分析中仍然存在许多挑战,其中包括开发强大的平台来研究3D神经元网络的多个深度的电生理信号。虽然已经开发了各种3D mea来探测层状神经系统内的特定深度,但制造具有不同高度的微电极,能够从表面以及神经结构内的不同层探测神经活动,仍然具有挑战性。本研究提出了一种新型的具有不同高度微电极的三维MEA,通过多阶段模具辅助电沉积工艺实现。我们的开创性平台允许对单个微电极的高度以及阵列拓扑进行细致的控制,为制造由多个高度的电极组成的3D mea铺平了道路,这些电极可以针对特定的应用和实验进行定制。该装置的性能特点是测量电化学阻抗和噪声,并捕获来自人类诱导多能干细胞的神经球的自发电生理活动。这些评估明确地验证了我们创新的多高度3D MEA作为体外3D神经元研究的前卫平台的巨大潜力。
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来源期刊
Journal of Micromechanics and Microengineering
Journal of Micromechanics and Microengineering 工程技术-材料科学:综合
CiteScore
4.50
自引率
4.30%
发文量
136
审稿时长
2.8 months
期刊介绍: Journal of Micromechanics and Microengineering (JMM) primarily covers experimental work, however relevant modelling papers are considered where supported by experimental data. The journal is focussed on all aspects of: -nano- and micro- mechanical systems -nano- and micro- electomechanical systems -nano- and micro- electrical and mechatronic systems -nano- and micro- engineering -nano- and micro- scale science Please note that we do not publish materials papers with no obvious application or link to nano- or micro-engineering. Below are some examples of the topics that are included within the scope of the journal: -MEMS and NEMS: Including sensors, optical MEMS/NEMS, RF MEMS/NEMS, etc. -Fabrication techniques and manufacturing: Including micromachining, etching, lithography, deposition, patterning, self-assembly, 3d printing, inkjet printing. -Packaging and Integration technologies. -Materials, testing, and reliability. -Micro- and nano-fluidics: Including optofluidics, acoustofluidics, droplets, microreactors, organ-on-a-chip. -Lab-on-a-chip and micro- and nano-total analysis systems. -Biomedical systems and devices: Including bio MEMS, biosensors, assays, organ-on-a-chip, drug delivery, cells, biointerfaces. -Energy and power: Including power MEMS/NEMS, energy harvesters, actuators, microbatteries. -Electronics: Including flexible electronics, wearable electronics, interface electronics. -Optical systems. -Robotics.
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