Damping of 3D-printed polymer microbeam resonators

IF 2.4 4区工程技术 Q2 ENGINEERING, ELECTRICAL & ELECTRONIC

Journal of Micromechanics and Microengineering Pub Date : 2023-11-02 DOI:10.1088/1361-6439/ad08ef

Jikke de Winter, Tomás Manzaneque, Murali Krishna Ghatkesar

引用次数: 0

Abstract

Abstract The emerging high-resolution 3D printing technique called two-photon polymerization (2PP) enables to print devices bottom-up rapidly, contrary to the top-down lithography-based fabrication methods. In this work, various polymer microbeams are 3D printed and their resonant characteristics are analyzed to understand the origin of damping. The 2PP printed polymer resonators have shown less damping than other polymer devices reported earlier, with tensile-stressed clamped-clamped beams reaching a record quality factor of 1819. The resonant energy loss was dominant by bulk friction damping. These results pave the path towards using 3D printed microresonators as mass sensors with improved design and fabrication ﬂexibility.

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3d打印聚合物微束谐振器的阻尼

新兴的高分辨率3D打印技术称为双光子聚合(2PP)，能够自下而上快速打印器件，这与自上而下的基于光刻的制造方法相反。在这项工作中，3D打印了各种聚合物微梁，并分析了它们的谐振特性，以了解阻尼的来源。与之前报道的其他聚合物器件相比，2PP打印的聚合物谐振器显示出更小的阻尼，拉伸应力夹紧-夹紧梁的质量因子达到了创纪录的1819。共振能量损失主要是体摩擦阻尼。这些结果为使用3D打印微谐振器作为质量传感器铺平了道路，提高了设计和制造的灵活性。

本文章由计算机程序翻译，如有差异，请以英文原文为准。

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来源期刊

Journal of Micromechanics and Microengineering 工程技术-材料科学：综合

CiteScore

4.50

自引率

4.30%

发文量

136

审稿时长

2.8 months

期刊介绍： Journal of Micromechanics and Microengineering (JMM) primarily covers experimental work, however relevant modelling papers are considered where supported by experimental data. The journal is focussed on all aspects of: -nano- and micro- mechanical systems -nano- and micro- electomechanical systems -nano- and micro- electrical and mechatronic systems -nano- and micro- engineering -nano- and micro- scale science Please note that we do not publish materials papers with no obvious application or link to nano- or micro-engineering. Below are some examples of the topics that are included within the scope of the journal: -MEMS and NEMS: Including sensors, optical MEMS/NEMS, RF MEMS/NEMS, etc. -Fabrication techniques and manufacturing: Including micromachining, etching, lithography, deposition, patterning, self-assembly, 3d printing, inkjet printing. -Packaging and Integration technologies. -Materials, testing, and reliability. -Micro- and nano-fluidics: Including optofluidics, acoustofluidics, droplets, microreactors, organ-on-a-chip. -Lab-on-a-chip and micro- and nano-total analysis systems. -Biomedical systems and devices: Including bio MEMS, biosensors, assays, organ-on-a-chip, drug delivery, cells, biointerfaces. -Energy and power: Including power MEMS/NEMS, energy harvesters, actuators, microbatteries. -Electronics: Including flexible electronics, wearable electronics, interface electronics. -Optical systems. -Robotics.