Silicon wafer bonding by the glass-like sol-gel formed nanocomposite

Abstract

We have herein developed a glass-forming composition and the related sol-gel technology for bonding monocrystalline silicon wafers to produce «silicon–insulator–silicon» structures. A possibility to fabricate defect-free glass-like bonding layers at the annealing temperature decreased to 1000–1100 °C is demonstrated. The composites obtained by the sol-gel method can be used in technological processes of formation of the solid compound of silicon wafers.