Optimization of Package Heat Dissipation Design Based on High-power WB-BGA Industrial Chip with a Wide Temperature Range

IF 4.6 Q1 OPTICS
Shihua Duan, Dejian Li, Yuan Guan, Bofu Li, Dameng Li, Baobin Yang, Shunfeng Han
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引用次数: 0

Abstract

Abstract With the progress of science and technology, chip integration and packaging density continue to improve, and the power density increases rapidly, leading to the increasingly prominent problem of chip heat dissipation. The service environment of industrial chips with a wide temperature range is even worse, so it is necessary to ensure reliable operation in the environment of −40°C~85°C. The thermal design and thermal management of packaging have become an important problem in the industry. Based on the wide temperature range of high-power WB-BGA industrial chips, aiming at the difficulty of chip heat dissipation in the high-temperature environment of 85°C, this paper studies and optimizes the packaging heat dissipation, and proposes a high heat dissipation packaging design scheme based on the wide temperature-range high-power WB-BGA industrial chip, which reduces the chip junction temperature by 17.9°C and has a certain reference value for the packaging design of wide temperature range industrial chip.
基于大功率宽温度范围WB-BGA工业芯片的封装散热优化设计
随着科学技术的进步,芯片集成度和封装密度不断提高,功率密度迅速增加,导致芯片散热问题日益突出。宽温度范围的工业芯片的使用环境更加恶劣,因此需要保证在−40℃~85℃的环境下可靠运行。封装的热设计和热管理已成为业界的一个重要问题。基于大功率WB-BGA工业芯片的宽温度范围,针对芯片在85℃高温环境下散热困难的问题,本文对封装散热进行了研究和优化,提出了基于宽温度范围大功率WB-BGA工业芯片的高散热封装设计方案。使芯片结温降低17.9℃,对宽温度范围工业芯片的封装设计具有一定的参考价值。
本文章由计算机程序翻译,如有差异,请以英文原文为准。
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来源期刊
CiteScore
10.70
自引率
0.00%
发文量
27
审稿时长
12 weeks
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