{"title":"Efficient Wafer-level Spatial Variation Modeling for Multi-site RF IC Testing","authors":"Riaz-ul-haque MIAN, Tomoki NAKAMURA, Masuo KAJIYAMA, Makoto EIKI, Michihiro SHINTANI","doi":"10.1587/transfun.2023eap1115","DOIUrl":null,"url":null,"abstract":"Wafer-level performance prediction techniques have been increasingly gaining attention in production LSI testing due to their ability to reduce measurement costs without compromising test quality. Despite the availability of several efficient methods, the site-to-site variation commonly observed in multi-site testing for radio frequency circuits remains inadequately addressed. In this manuscript, we propose a wafer-level performance prediction approach for multi-site testing that takes into account the site-to-site variation. Our proposed method is built on the Gaussian process, a widely utilized wafer-level spatial correlation modeling technique, and enhances prediction accuracy by extending hierarchical modeling to leverage the test site information test engineers provide. Additionally, we propose a test-site sampling method that maximizes cost reduction while maintaining sufficient estimation accuracy. Our experimental results, which employ industrial production test data, demonstrate that our proposed method can decrease the estimation error to 1/19 of that a conventional method achieves. Furthermore, our sampling method can reduce the required measurements by 97% while ensuring satisfactory estimation accuracy.","PeriodicalId":55003,"journal":{"name":"Ieice Transactions on Fundamentals of Electronics Communications and Computer Sciences","volume":null,"pages":null},"PeriodicalIF":0.4000,"publicationDate":"2023-01-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"0","resultStr":null,"platform":"Semanticscholar","paperid":null,"PeriodicalName":"Ieice Transactions on Fundamentals of Electronics Communications and Computer Sciences","FirstCategoryId":"1085","ListUrlMain":"https://doi.org/10.1587/transfun.2023eap1115","RegionNum":4,"RegionCategory":"计算机科学","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"Q4","JCRName":"COMPUTER SCIENCE, HARDWARE & ARCHITECTURE","Score":null,"Total":0}
引用次数: 0
Abstract
Wafer-level performance prediction techniques have been increasingly gaining attention in production LSI testing due to their ability to reduce measurement costs without compromising test quality. Despite the availability of several efficient methods, the site-to-site variation commonly observed in multi-site testing for radio frequency circuits remains inadequately addressed. In this manuscript, we propose a wafer-level performance prediction approach for multi-site testing that takes into account the site-to-site variation. Our proposed method is built on the Gaussian process, a widely utilized wafer-level spatial correlation modeling technique, and enhances prediction accuracy by extending hierarchical modeling to leverage the test site information test engineers provide. Additionally, we propose a test-site sampling method that maximizes cost reduction while maintaining sufficient estimation accuracy. Our experimental results, which employ industrial production test data, demonstrate that our proposed method can decrease the estimation error to 1/19 of that a conventional method achieves. Furthermore, our sampling method can reduce the required measurements by 97% while ensuring satisfactory estimation accuracy.
期刊介绍:
Includes reports on research, developments, and examinations performed by the Society''s members for the specific fields shown in the category list such as detailed below, the contents of which may advance the development of science and industry:
(1) Reports on new theories, experiments with new contents, or extensions of and supplements to conventional theories and experiments.
(2) Reports on development of measurement technology and various applied technologies.
(3) Reports on the planning, design, manufacture, testing, or operation of facilities, machinery, parts, materials, etc.
(4) Presentation of new methods, suggestion of new angles, ideas, systematization, software, or any new facts regarding the above.