Design of a CPU Heat Sink with Minichannel-Fins & its Thermal Analysis

Abstract

Abstract In this paper, the design and the thermal analysis of a tribled microprocessor cooler combining the advantages of strong swirl flow and minichannel-fins and CuO nanofluid, have been presented. It is thought that the results will contribute to the understanding of the effects of parameters on the cooling flux of the heat sink and the decline at the microprocessor temperature, as Reynolds number in the minichannels and CuO % volume fraction. The results have exhibited that the total performance of the heat sink cooled with the mixture of water–CuO-EG nanofluids increases with the increase of Re number and the %load of nanoparticles in the coolant. It has been determined that the energy withdrawn from the microprocessor was 241 times higher than the energy generated for maximum CuO load and Re number conditions. Besides, the highest temperature decrease has been measured at the maximum CuO load value and maximum Re number.