Measuring Thermal Migration

IF 1.5 Q2 PHYSICS, MULTIDISCIPLINARY
Physics Pub Date : 2023-09-15 DOI:10.1103/physics.16.157
Michael Schirber
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引用次数: 0

Abstract

I n cell phones and other devices, a large temperature difference across a microcircuit can cause atoms to migrate, eventually resulting in faulty electrical connections. This so-called thermomigration has now been tracked at the microscale, revealing a diffusion-related force that drives the motion [1]. The researchers studied shallow depressions, or “basins,” on the surface of a square silicon wafer that was heated on one edge and cooled on the opposite edge. They
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来源期刊
Physics
Physics PHYSICS, MULTIDISCIPLINARY-
CiteScore
3.00
自引率
6.20%
发文量
0
审稿时长
10 weeks
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