{"title":"Fabrication of High-Performance Insulated Metal Substrates Employing h-BN Mixture/Epoxy Composite Coated on Roughened Copper Plate","authors":"Zhigang LI, Yigang HE, Hao ZHAO, Jianyu WU, Zhenbo ZHAO","doi":"10.5755/j02.ms.34711","DOIUrl":null,"url":null,"abstract":"In this work, an Insulated Metal Substrate (IMS) for packaging high-power electronic devices was created using hexagonal Boron Nitride (h-BN) mixture-based Thermally Conductive Adhesive (TCA) and copper plate with a matte side. Mechanical exfoliation of micron-scale BN particles results in a BN mixture containing h-BN nanosheets, micron particles, and nanoparticles. TCA was synthesized by dispersing a 40 % BN mixture modified by γ-aminopropyltriethoxysilane (KH550) into epoxy resin. The TCA has a relatively high thermal conductivity of 4.48 W·m-1·K-1 and a breakdown strength of 15.32 kV·mm-1. As the TCA film was coated on the matte side of the copper plate, the peel strength can reach 1.63 N·mm-1, indicating excellent practicality in the field of electronic packaging.","PeriodicalId":18298,"journal":{"name":"Materials Science-medziagotyra","volume":null,"pages":null},"PeriodicalIF":0.8000,"publicationDate":"2023-11-08","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"0","resultStr":null,"platform":"Semanticscholar","paperid":null,"PeriodicalName":"Materials Science-medziagotyra","FirstCategoryId":"1085","ListUrlMain":"https://doi.org/10.5755/j02.ms.34711","RegionNum":4,"RegionCategory":"材料科学","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"Q4","JCRName":"MATERIALS SCIENCE, MULTIDISCIPLINARY","Score":null,"Total":0}
引用次数: 0
Abstract
In this work, an Insulated Metal Substrate (IMS) for packaging high-power electronic devices was created using hexagonal Boron Nitride (h-BN) mixture-based Thermally Conductive Adhesive (TCA) and copper plate with a matte side. Mechanical exfoliation of micron-scale BN particles results in a BN mixture containing h-BN nanosheets, micron particles, and nanoparticles. TCA was synthesized by dispersing a 40 % BN mixture modified by γ-aminopropyltriethoxysilane (KH550) into epoxy resin. The TCA has a relatively high thermal conductivity of 4.48 W·m-1·K-1 and a breakdown strength of 15.32 kV·mm-1. As the TCA film was coated on the matte side of the copper plate, the peel strength can reach 1.63 N·mm-1, indicating excellent practicality in the field of electronic packaging.
期刊介绍:
It covers the fields of materials science concerning with the traditional engineering materials as well as advanced materials and technologies aiming at the implementation and industry applications. The variety of materials under consideration, contributes to the cooperation of scientists working in applied physics, chemistry, materials science and different fields of engineering.