Fabrication of High-Performance Insulated Metal Substrates Employing h-BN Mixture/Epoxy Composite Coated on Roughened Copper Plate

IF 0.8 4区 材料科学 Q4 MATERIALS SCIENCE, MULTIDISCIPLINARY
Zhigang LI, Yigang HE, Hao ZHAO, Jianyu WU, Zhenbo ZHAO
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引用次数: 0

Abstract

In this work, an Insulated Metal Substrate (IMS) for packaging high-power electronic devices was created using hexagonal Boron Nitride (h-BN) mixture-based Thermally Conductive Adhesive (TCA) and copper plate with a matte side. Mechanical exfoliation of micron-scale BN particles results in a BN mixture containing h-BN nanosheets, micron particles, and nanoparticles. TCA was synthesized by dispersing a 40 % BN mixture modified by γ-aminopropyltriethoxysilane (KH550) into epoxy resin. The TCA has a relatively high thermal conductivity of 4.48 W·m-1·K-1 and a breakdown strength of 15.32 kV·mm-1. As the TCA film was coated on the matte side of the copper plate, the peel strength can reach 1.63 N·mm-1, indicating excellent practicality in the field of electronic packaging.
粗化铜板上涂覆h-BN混合物/环氧复合材料制备高性能绝缘金属基板
在这项工作中,使用六方氮化硼(h-BN)混合物为基础的导热胶(TCA)和具有哑光一面的铜板,创建了用于封装大功率电子器件的绝缘金属基板(IMS)。微米级氮化硼颗粒的机械剥离会产生含有氢氮化硼纳米片、微米颗粒和纳米颗粒的氮化硼混合物。将经γ-氨基丙基三乙氧基硅烷(KH550)改性的40% BN混合料分散在环氧树脂中制备TCA。TCA的导热系数为4.48 W·m-1·K-1,击穿强度为15.32 kV·mm-1。由于将TCA薄膜涂覆在铜板的哑光面,剥离强度可达1.63 N·mm-1,在电子封装领域具有优异的实用性。
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来源期刊
Materials Science-medziagotyra
Materials Science-medziagotyra 工程技术-材料科学:综合
CiteScore
1.70
自引率
10.00%
发文量
92
审稿时长
6-12 weeks
期刊介绍: It covers the fields of materials science concerning with the traditional engineering materials as well as advanced materials and technologies aiming at the implementation and industry applications. The variety of materials under consideration, contributes to the cooperation of scientists working in applied physics, chemistry, materials science and different fields of engineering.
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