Microstructure Formation on Glass Substrates for High-productivity Fabrication of Micro-vias Using 248 nm Excimer Laser

Abstract

High-productivity fabrication of micro-vias in glass substrates is required for post-5G high-frequency signal interposers. This paper describes the fabrication of high-quality micro-vias with a high aspect ratio by ablation using a 248 nm excimer laser. To clarify the details of the ablation process, we investigate the surface microstructure generated by excimer laser irradiation. The results indicate that laser irradiation produces a surface microstructure that enhances the absorption of laser energy.