Hollow glass microspheres/montmorillonite/epoxy sheet molding compound composites with low density and excellent mechanical properties

Zhixiong Huang, Guoqin Jiang, Yue Wu, Jialuo Wu, Zongyi Deng
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引用次数: 1

Abstract

AbstractEpoxy sheet molding compound (ESMC) composites have good mechanical properties, insulation performance and corrosion resistance, and are widely used in the automotive industry. However, the density of a typical ESMC composite is high, which limits its wider application. Lightweight fillers can reduce the density of ESMC composites, but the addition of lightweight fillers can lead to a decrease in the mechanical properties of the composite. In this paper, we describe our research in which hollow glass microspheres (HGM) were utilized to decrease the density of the ESMC composites. In addition, surface modification of the HGM was performed to enhance the compatibility between the HGM and the epoxy resin (EP), thus improving the mechanical properties. Further, montmorillonite (MMT) was introduced to further improve the mechanical properties of the ESMC composites. The results showed that the density of the prepared composite was about 1.5 g/cm3, which was significantly lower than the industry standard sheet molding compound (SMC) density of 1.9 g/cm3. The flexural strength and impact strength of the resulting ESMC composites containing the modified HGM and an appropriate amount of MMT (EP/SiHGM/MMT-1) reached the maximum value of 80.0 MPa and 28.6 kJ/m2, respectively, which were 39.9% and 51.3% higher than that of the ESMC composite containing only HGM (EP/HGM/MMT-0). On the one hand, the modified HGM was well dispersed in the EP for the chemical bonding effect. On the other hand, the fiber/matrix interface was further improved after introducing an appropriate amount of MMT. Thus, the resulting ESMC composite exhibited low density and excellent mechanical properties and showed great potential for applications that require lightweight and high strength.Keywords: Hollow glass microspheresSurface modificationMontmorilloniteEpoxy sheet molding compoundLow densityExcellent mechanical propertiesDisclaimerAs a service to authors and researchers we are providing this version of an accepted manuscript (AM). Copyediting, typesetting, and review of the resulting proofs will be undertaken on this manuscript before final publication of the Version of Record (VoR). During production and pre-press, errors may be discovered which could affect the content, and all legal disclaimers that apply to the journal relate to these versions also.
中空玻璃微珠/蒙脱土/环氧板成型复合材料具有低密度和优异的机械性能
摘要环氧板材成型复合材料(ESMC)具有良好的机械性能、绝缘性能和耐腐蚀性能,在汽车工业中得到广泛应用。然而,典型的ESMC复合材料的密度较高,限制了其更广泛的应用。轻质填料可以降低ESMC复合材料的密度,但轻质填料的加入会导致复合材料的力学性能下降。本文介绍了利用中空玻璃微球(HGM)降低ESMC复合材料密度的研究。此外,还对HGM进行了表面改性,增强了HGM与环氧树脂(EP)的相容性,从而改善了HGM的力学性能。此外,蒙脱土(MMT)的加入进一步改善了ESMC复合材料的力学性能。结果表明,制备的复合材料密度约为1.5 g/cm3,明显低于工业标准SMC (sheet molding compound, SMC)的密度1.9 g/cm3。加入改性HGM和适量MMT (EP/SiHGM/MMT-1)的ESMC复合材料的抗折强度和冲击强度达到最大值,分别为80.0 MPa和28.6 kJ/m2,比只加入HGM (EP/HGM/MMT-0)的ESMC复合材料提高了39.9%和51.3%。一方面,改性后的HGM在EP中分散良好,具有化学键合效应。另一方面,引入适量的MMT后,纤维/基体界面进一步改善。因此,得到的ESMC复合材料具有低密度和优异的机械性能,在需要轻量化和高强度的应用中显示出巨大的潜力。关键词:中空玻璃微珠表面改性蒙脱石环氧板成型复合材料低密度优异的机械性能免责声明作为对作者和研究人员的服务,我们提供了这个版本的接受稿件(AM)。在最终出版版本记录(VoR)之前,将对该手稿进行编辑、排版和审查。在制作和印前,可能会发现可能影响内容的错误,所有适用于期刊的法律免责声明也与这些版本有关。
本文章由计算机程序翻译,如有差异,请以英文原文为准。
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