Optimization of natural cooled heat sinks for panel mounted solid state relays

Abstract

ABSTRACTA solid state relay mounted at a cabinet wall dissipating 30W heat is considered in this analysis. A parallel plate mid-finned heat sink is designed for the relay to accommodate within 100 × 60 × 100 mm3 volume. A heatsink of 100 mm × 56 mm base size, 6 mm trunk thickness, 3 mm fin thickness, 6 mm fin spacing, and 102 mm length is attained by optimization. Further, it is optimized by trimming off the inefficient portion of the fin height, thereby attaining a taper heat sink without compromising the thermal performance. The appraisement of this trimming is characterized by the taper angle formed between the base of the heat sink and the line connecting all fin tips. The temperature profiles for heatsinks with 90°, 85° and 80° taper angle are presented in this paper for various power levels. The heat sink with 85° taper angle is optimum and the same is fabricated and tested experimentally. Thus, the parallel plate heat sink is optimized to improve the overall fin effectiveness and a 13% reduction in weight is achieved at 85° taper angle with a notional increment in temperature.DisclaimerAs a service to authors and researchers we are providing this version of an accepted manuscript (AM). Copyediting, typesetting, and review of the resulting proofs will be undertaken on this manuscript before final publication of the Version of Record (VoR). During production and pre-press, errors may be discovered which could affect the content, and all legal disclaimers that apply to the journal relate to these versions also. Additional informationNotes on contributorsPalani Nainar Palani Nainar is orking as a Scientist at SAMEER-Centre for Electromagnetics, Chennai, an R&D institution under the Ministry of Electronics and Information Technology, Govt. of India. He received his Bachelor's Degree in Mechanical Engineering from Madurai Kamaraj University and a Master's Degree from the National Institute of Technology, Trichy. Since 2004, he has established facilities to evaluate, analyze and validate the thermal performance of electronic products in the Electronics Packaging Division at SAMEER.Karuppaiah Ramaiah Karuppaiah Ramaiah is working as a Research Scientist with Electronics Packaging Division in SAMEER-Centre for Electromagnetics, Chennai. He received his Bachelor's Degree in Mechanical Engineering from the University College of Engineering, Anna University, Dindigul. He is working in the area of design and development of thermal management systems for electronics packaging. He has secured knowledge in the use of CAD/CFD tools for thermal analysis of electronic systems.Dhanushkodi Ganesan Dhanushkodi Ganesan received his Bachelor of Engineering from Madurai Kamaraj University in the year 1997 and Master's Degree from Anna University in the year 2007 and joined SAMEER-Centre for Electromagnetics, Chennai. Since 1997 he has been working as a scientist with the Electronics Packaging Division. Currently doing his research in thermal management of electronics systems deployed under harsh environments. Handled several testing and consultancy assignments from commercial electronics to space electronics, module-level to shelter level; established the state-of-the-art test facilities for thermal management of electronics systems.