THERMAL FLOW FIELD ANALYSIS OF HEAT SINK FOR IMPROVING COOLING EFFICIENCY OF AVIONICS EQUIPMENT

M.G. Kang, D.H. Kim, D.I. Jang, H. Lee, R.S. Myong
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Abstract

The amount of heat generated by avionics equipment in aircraft increases as more electrical components become compact. Avionics directly affects airplane performance, and thermal management systems play an important role in maintaining safety and performance. In this study, thermal analysis of avionics equipment mounted on aircraft was conducted to improve performance by considering shape modification and fan operation. A temperature difference of up to 55°C was observed for the basic shape when the fan was not operated. Several attempts such as the change of shape and material were made, but it was observed that the devices reached an excessive temperature. It was shown that the devices reached the proper level of temperature where forced convection was imposed by operating the fan. This study will provide critical information for the development of improved cooling methods for avionics and derivation of environmental conditions.
提高航空电子设备冷却效率的散热器热流场分析
随着越来越多的电子元件变得紧凑,飞机上的航空电子设备产生的热量也在增加。航空电子设备直接影响飞机的性能,热管理系统在维护飞机安全和性能方面起着重要作用。在本研究中,为了提高机载航电设备的性能,考虑了形状修改和风扇操作,对机载航电设备进行了热分析。当不操作风扇时,观察到基本形状的温差高达55°C。人们尝试改变形状和材料,但发现设备温度过高。结果表明,该装置达到了适当的温度水平,其中通过操作风扇施加强制对流。这项研究将为改进航空电子设备冷却方法的发展和环境条件的推导提供关键信息。
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