{"title":"Research on Cloud Platform Software Aging Prediction Method Based on VMD-ARIMA-BilSTM Combined Model","authors":"Fengdong Shi, Zhi Yuan, Min Wang, Jun Cui","doi":"10.1080/10584587.2023.2192665","DOIUrl":null,"url":null,"abstract":"AbstractWhen the cloud platform runs under heavy load for a long time, internal resources will be consumed and errors will accumulate continuously. As a result, the software aging phenomenon occurs, which ultimately degrades the performance and reliability of the software system. Aiming at the above problems, this paper proposes a hybrid model based on integrated variational mode decomposition, moving average free regression and long and short memory network (VMD-ARIMA-BILSTM) to predict the software aging problem. Firstly, the original resource utilization rate is decomposed into stationary time series and non-stationary time series by variational mode decomposition. Then, the advantages of moving average free regression and bidirectional long short-term memory network are used to predict stationary and non-stationary series respectively. Finally, the prediction results are reconstructed to obtain the final prediction results. Experimental results show that compared with single ARIMA and BI-LSTM, the hybrid model designed in this paper has higher prediction accuracy and faster convergence speed.Keywords: Cloud platformsoftware agingVMDARIMABILSTM Disclosure StatementNo potential conflict of interest was reported by the author(s).","PeriodicalId":13686,"journal":{"name":"Integrated Ferroelectrics","volume":"43 1","pages":"0"},"PeriodicalIF":0.7000,"publicationDate":"2023-09-02","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"0","resultStr":null,"platform":"Semanticscholar","paperid":null,"PeriodicalName":"Integrated Ferroelectrics","FirstCategoryId":"1085","ListUrlMain":"https://doi.org/10.1080/10584587.2023.2192665","RegionNum":4,"RegionCategory":"工程技术","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"Q4","JCRName":"ENGINEERING, ELECTRICAL & ELECTRONIC","Score":null,"Total":0}
引用次数: 0
Abstract
AbstractWhen the cloud platform runs under heavy load for a long time, internal resources will be consumed and errors will accumulate continuously. As a result, the software aging phenomenon occurs, which ultimately degrades the performance and reliability of the software system. Aiming at the above problems, this paper proposes a hybrid model based on integrated variational mode decomposition, moving average free regression and long and short memory network (VMD-ARIMA-BILSTM) to predict the software aging problem. Firstly, the original resource utilization rate is decomposed into stationary time series and non-stationary time series by variational mode decomposition. Then, the advantages of moving average free regression and bidirectional long short-term memory network are used to predict stationary and non-stationary series respectively. Finally, the prediction results are reconstructed to obtain the final prediction results. Experimental results show that compared with single ARIMA and BI-LSTM, the hybrid model designed in this paper has higher prediction accuracy and faster convergence speed.Keywords: Cloud platformsoftware agingVMDARIMABILSTM Disclosure StatementNo potential conflict of interest was reported by the author(s).
期刊介绍:
Integrated Ferroelectrics provides an international, interdisciplinary forum for electronic engineers and physicists as well as process and systems engineers, ceramicists, and chemists who are involved in research, design, development, manufacturing and utilization of integrated ferroelectric devices. Such devices unite ferroelectric films and semiconductor integrated circuit chips. The result is a new family of electronic devices, which combine the unique nonvolatile memory, pyroelectric, piezoelectric, photorefractive, radiation-hard, acoustic and/or dielectric properties of ferroelectric materials with the dynamic memory, logic and/or amplification properties and miniaturization and low-cost advantages of semiconductor i.c. technology.