{"title":"Thick films for high-temperature piezoelectric applications - a future reference","authors":"Sruthi S, Manoranjan Sahoo, Soma Dutta","doi":"10.1007/s10832-023-00331-z","DOIUrl":null,"url":null,"abstract":"<div><p>The piezoelectric thick film of the active component that works at high temperatures for space and aeronautics has been in significant demand. The thick film has great technological importance as its thickness lies between the thin film and bulk material. The application, such as sensors and actuators, require a thickness that is not less than thin film or not more than bulk to be sufficiently powerful and sensitive. While the thick film is exposed to a temperature higher than room temperature, the piezoelectricity and elastic properties should not be degraded. Thus researchers have been investigating high-temperature thick films for the past decade. This review focuses on the detailed study of high-temperature piezoelectric thick films of lead-based and lead-free based materials and their composites, highlighting fabrication methods. Other important areas, such as substrates for thick film properties achieved and targeted applications, are also discussed. This discussion shows that selecting the high-temperature piezoelectric material, fabrication method, substrates, etc., are essential for fabricating a high-temperature piezoelectric transducer.</p></div>","PeriodicalId":625,"journal":{"name":"Journal of Electroceramics","volume":"51 4","pages":"269 - 280"},"PeriodicalIF":1.7000,"publicationDate":"2023-09-26","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"0","resultStr":null,"platform":"Semanticscholar","paperid":null,"PeriodicalName":"Journal of Electroceramics","FirstCategoryId":"88","ListUrlMain":"https://link.springer.com/article/10.1007/s10832-023-00331-z","RegionNum":4,"RegionCategory":"材料科学","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"Q2","JCRName":"MATERIALS SCIENCE, CERAMICS","Score":null,"Total":0}
引用次数: 0
Abstract
The piezoelectric thick film of the active component that works at high temperatures for space and aeronautics has been in significant demand. The thick film has great technological importance as its thickness lies between the thin film and bulk material. The application, such as sensors and actuators, require a thickness that is not less than thin film or not more than bulk to be sufficiently powerful and sensitive. While the thick film is exposed to a temperature higher than room temperature, the piezoelectricity and elastic properties should not be degraded. Thus researchers have been investigating high-temperature thick films for the past decade. This review focuses on the detailed study of high-temperature piezoelectric thick films of lead-based and lead-free based materials and their composites, highlighting fabrication methods. Other important areas, such as substrates for thick film properties achieved and targeted applications, are also discussed. This discussion shows that selecting the high-temperature piezoelectric material, fabrication method, substrates, etc., are essential for fabricating a high-temperature piezoelectric transducer.
期刊介绍:
While ceramics have traditionally been admired for their mechanical, chemical and thermal stability, their unique electrical, optical and magnetic properties have become of increasing importance in many key technologies including communications, energy conversion and storage, electronics and automation. Electroceramics benefit greatly from their versatility in properties including:
-insulating to metallic and fast ion conductivity
-piezo-, ferro-, and pyro-electricity
-electro- and nonlinear optical properties
-feromagnetism.
When combined with thermal, mechanical, and chemical stability, these properties often render them the materials of choice.
The Journal of Electroceramics is dedicated to providing a forum of discussion cutting across issues in electrical, optical, and magnetic ceramics. Driven by the need for miniaturization, cost, and enhanced functionality, the field of electroceramics is growing rapidly in many new directions. The Journal encourages discussions of resultant trends concerning silicon-electroceramic integration, nanotechnology, ceramic-polymer composites, grain boundary and defect engineering, etc.