Al-Cu Composite’s Springback in Micro Deep Drawing

IF 0.9 Q3 ENGINEERING, MULTIDISCIPLINARY
Julian Widiatmoko, Fanghui Jia, Zhengyi Jiang
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引用次数: 0

Abstract

With the recent technological trend of miniaturization in manufacturing industries, the rise of micro forming operations such as micro deep drawing (MDD) is inevitable. On the other hand, the need of more advanced materials is essential to accommodate various applications. However, a major problem are size effects that make micro scale operations challenging. One of the most important behaviors affected by size effects is the springback phenomenon, which is the tendency of a deformed material to go back to its original shape. Springback can affect dimensional accuracy, which is very important in micro products. Thus, this paper investigated the springback behavior of Al-Cu composite in MDD operations. Micro cups were fabricated from blank sheet specimens using an MDD apparatus with variation of annealing holding time. The springback values were measured and compared to each other. The results showed that different grain sizes lead to variation in the amount of springback. However, unlike in single-element materials, the amount of springback in Al-Cu composite is not only related to the thickness to grain size (t/d) ratio. Another factor, i.e., the existence of an interfacial region between layers, alters the mechanical behavior of the composite.
Al-Cu复合材料微拉深回弹性能研究
随着近年来制造业小型化的技术趋势,微拉深等微成形工艺的兴起是必然的。另一方面,需要更先进的材料是必要的,以适应各种应用。然而,一个主要的问题是尺寸效应,这使得微观规模的操作具有挑战性。受尺寸效应影响的最重要的行为之一是回弹现象,即变形后的材料恢复到其原始形状的趋势。回弹会影响尺寸精度,这在微细产品中是非常重要的。因此,本文研究了铝铜复合材料在MDD作业中的回弹行为。利用MDD装置,利用不同的退火保温时间,制备了微杯。测量回弹值并相互比较。结果表明,不同的晶粒尺寸会导致回弹量的变化。然而,与单元素材料不同,Al-Cu复合材料的回弹量不仅与厚度与晶粒尺寸(t/d)比有关。另一个因素,即层间界面区域的存在,改变了复合材料的力学行为。
本文章由计算机程序翻译,如有差异,请以英文原文为准。
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来源期刊
Journal of Engineering and Technological Sciences
Journal of Engineering and Technological Sciences ENGINEERING, MULTIDISCIPLINARY-
CiteScore
2.30
自引率
11.10%
发文量
77
审稿时长
24 weeks
期刊介绍: Journal of Engineering and Technological Sciences welcomes full research articles in the area of Engineering Sciences from the following subject areas: Aerospace Engineering, Biotechnology, Chemical Engineering, Civil Engineering, Electrical Engineering, Engineering Physics, Environmental Engineering, Industrial Engineering, Information Engineering, Mechanical Engineering, Material Science and Engineering, Manufacturing Processes, Microelectronics, Mining Engineering, Petroleum Engineering, and other application of physical, biological, chemical and mathematical sciences in engineering. Authors are invited to submit articles that have not been published previously and are not under consideration elsewhere.
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