Determination of Lumped Element Package Model for Radio Frequency Surface Acoustic Wave Device Using Neural Network Techniques

Abstract

Electronic packaging has a significant influence on RF surface acoustic wave (SAW) device. Hence, how to incorporate packaging effects into SAW simulation is an important issue. In this paper, neural network was employed to determine the lumped element models of bonding pads. As an example, an RF SAW filter used in GPS system was examined. The result showed a good agreement with that obtained from full wave EM simulator.