A. Finocchiaro, G. Girlando, Alessandro Motta, A. Pagani, G. Palmisano
{"title":"A fully contactless wafer-level testing for UHF RFID tag with on-chip antenna","authors":"A. Finocchiaro, G. Girlando, Alessandro Motta, A. Pagani, G. Palmisano","doi":"10.1109/DTIS.2018.8368554","DOIUrl":null,"url":null,"abstract":"A fully contactless wafer-level testing for 860–960 MHz RFID tags has been demonstrated. For the first time, an array of 30 RFID ICs with On-Chip-Antenna (OCA) has been simultaneously tested by inductive coupling. The anti-collision algorithm in combination with the insertion of x-y coordinates on the memory bank of each device during the EWS tests has allowed to identify each tag of the wafer. Moreover, a wafer scribe line pre-cutting has permitted to avoid undesired eddy currents generation at wafer level.","PeriodicalId":328650,"journal":{"name":"2018 13th International Conference on Design & Technology of Integrated Systems In Nanoscale Era (DTIS)","volume":"2008 1","pages":"0"},"PeriodicalIF":0.0000,"publicationDate":"2018-04-09","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"4","resultStr":null,"platform":"Semanticscholar","paperid":null,"PeriodicalName":"2018 13th International Conference on Design & Technology of Integrated Systems In Nanoscale Era (DTIS)","FirstCategoryId":"1085","ListUrlMain":"https://doi.org/10.1109/DTIS.2018.8368554","RegionNum":0,"RegionCategory":null,"ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"","JCRName":"","Score":null,"Total":0}
引用次数: 4
Abstract
A fully contactless wafer-level testing for 860–960 MHz RFID tags has been demonstrated. For the first time, an array of 30 RFID ICs with On-Chip-Antenna (OCA) has been simultaneously tested by inductive coupling. The anti-collision algorithm in combination with the insertion of x-y coordinates on the memory bank of each device during the EWS tests has allowed to identify each tag of the wafer. Moreover, a wafer scribe line pre-cutting has permitted to avoid undesired eddy currents generation at wafer level.