Holographic interferometry in predicting cathodic deposition of metals in aqueous solution

Abstract

A mathematical model relating surface and bulk behaviors of metals in aqueous solution has been developed. The model was established based on principles of Holographic interferometry for measuring microsurface deposition, i.e., mass gain, and with those of electrochemistry for measuring the bulk electronic current, i.e., electroplating current. The model can be utilized to predict the electroplating behavior on metals subjected to cathodic reaction in aqueous solution. In other words, the cathodic current density of metals can be predicted as a function of microsurface deposition.