Electrical analysis of InGaAs-based planar and tri-gate nMOSFET with S/D resistance dependencies at different drain biases

N. A. F. Othman, S. Hatta, N. Soin
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Abstract

This paper studies the electrical analysis of InGaAs-based planar and tri-gate nMOSFET and the influence of the source/drain (S/D) resistance, Rsd on the current-voltage (${\text{I}}_{\text{d}}-{\text{V}}_{\text{g}}$) relation at different drain biases (${\text{V}}_{\text{ds}}$). It is found that the tri-gate nMOSFET simulated at high Vds has shown better performance compared to planar nMOSFET simulated at low Vds. As the Rsd is reduced, the drain current of both planar and tri-gate devices increases. The on-current to off-current (${\text{I}}_{\text{on}})/{\text{I}}_{\text{off}}$) ratio of the devices also increases as the Rsd reduced. Tri-gate nMOSFET shows significant improvement as the Ion/Ioff ratio is $10^{3}$ higher than the planar nMOSFET device.
基于ingaas的平面和三栅极nMOSFET在不同漏极偏置下的S/D电阻依赖性的电学分析
本文研究了基于ingaas的平面三栅极nMOSFET的电学分析,以及在不同漏极偏置(${\text{V}}_{\text{ds}}$)下,源极/漏极(S/D)电阻Rsd对电流-电压(${\text{I}}_{\text{D}}-{\text{g}}$)关系的影响。结果表明,与平面nMOSFET相比,高Vds下的三栅极nMOSFET具有更好的性能。当Rsd降低时,平面和三栅极器件的漏极电流都会增加。器件的通断电流(${\text{I}}_{\text{on}})/{\text{I}}_{\text{off}}$)比值也随着Rsd的降低而增加。三栅极nMOSFET表现出显著的改进,离子/开关比比平面nMOSFET器件高$10^{3}$。
本文章由计算机程序翻译,如有差异,请以英文原文为准。
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