Self-aligned Assembly Technology For Optical Devices Using AuSn Solder Bumps Flip-chip Bonding

LEOS '92 Conference Proceedings Pub Date : 1992-11-16 DOI:10.1109/LEOS.1992.693942

J. Sasaki, Y. Kaneyama, H. Honmou, M. Itoh, T. Uji

引用次数: 12

Abstract

A flip-chip bonding technique using AuSn solder bumps, which are mechanically formed an the substrate, has been developed. Self-aligned assembly used in laser diode chip was realized with /spl plusmn/1/spl mu/m bonding Positioning precision.

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利用AuSn焊料碰撞倒装晶片键合的光学器件自对准组装技术

利用在衬底上机械形成的AuSn焊料凸点，开发了一种倒装芯片键合技术。采用/spl plusmn/1/spl mu/m键合定位精度实现了激光二极管芯片的自对准装配。

本文章由计算机程序翻译，如有差异，请以英文原文为准。

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来源期刊

LEOS '92 Conference Proceedings

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