Sijin Wang, Chunsheng Guo, Boyang Liu, Lei Wei, Shiwei Zhang
{"title":"Measuring Junction Temperature Inhomogeneity of Double-chip IGBT Modules by Electrical Method","authors":"Sijin Wang, Chunsheng Guo, Boyang Liu, Lei Wei, Shiwei Zhang","doi":"10.1109/ICEDME50972.2020.00032","DOIUrl":null,"url":null,"abstract":"The electrical method for measuring junction temperature inhomogeneity of IGBT modules has always been a scientific research problem in the field of microelectronics. This paper proposes a new type of electrical method for measuring junction temperature inhomogeneity, which is different from the conventional electrical methods using a single test condition. The collector currents measured in this paper are at high and low gate voltage, respectively. Based on the temperature calibration curve and the IGBT chips parallel model, the junction temperature inhomogeneity of the double-chip IGBT modules was analyzed successfully, and the junction temperature of the two chips were obtained respectively.","PeriodicalId":155375,"journal":{"name":"2020 3rd International Conference on Electron Device and Mechanical Engineering (ICEDME)","volume":"4 1","pages":"0"},"PeriodicalIF":0.0000,"publicationDate":"2020-05-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"1","resultStr":null,"platform":"Semanticscholar","paperid":null,"PeriodicalName":"2020 3rd International Conference on Electron Device and Mechanical Engineering (ICEDME)","FirstCategoryId":"1085","ListUrlMain":"https://doi.org/10.1109/ICEDME50972.2020.00032","RegionNum":0,"RegionCategory":null,"ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"","JCRName":"","Score":null,"Total":0}
引用次数: 1
Abstract
The electrical method for measuring junction temperature inhomogeneity of IGBT modules has always been a scientific research problem in the field of microelectronics. This paper proposes a new type of electrical method for measuring junction temperature inhomogeneity, which is different from the conventional electrical methods using a single test condition. The collector currents measured in this paper are at high and low gate voltage, respectively. Based on the temperature calibration curve and the IGBT chips parallel model, the junction temperature inhomogeneity of the double-chip IGBT modules was analyzed successfully, and the junction temperature of the two chips were obtained respectively.