{"title":"Glass Patterning: Technologies and Applications","authors":"N. Toan, N. Inomata, M. Toda, T. Ono","doi":"10.5772/INTECHOPEN.74179","DOIUrl":null,"url":null,"abstract":"In this work, we review the progress in recent studies on glass patterning including technologies and applications. Four technologies for glass micromachining including wet etching, sandblasting, reactive ion etching, and glass reflow process are analyzed. Advantages as well as disadvantages of each method are presented and discussed in light of the experiments. Various microsystem applications using the above glass patterning technologies like thermal sensors, hermetically packaged capacitive silicon resonators, optical modulator devices, glass microfluidics, micro-heaters, and vacuum-sealed capacitive micromachined ultrasonic transducer arrays are reported.","PeriodicalId":118101,"journal":{"name":"Advances in Glass Science and Technology","volume":null,"pages":null},"PeriodicalIF":0.0000,"publicationDate":"2018-02-10","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"2","resultStr":null,"platform":"Semanticscholar","paperid":null,"PeriodicalName":"Advances in Glass Science and Technology","FirstCategoryId":"1085","ListUrlMain":"https://doi.org/10.5772/INTECHOPEN.74179","RegionNum":0,"RegionCategory":null,"ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"","JCRName":"","Score":null,"Total":0}
引用次数: 2
Abstract
In this work, we review the progress in recent studies on glass patterning including technologies and applications. Four technologies for glass micromachining including wet etching, sandblasting, reactive ion etching, and glass reflow process are analyzed. Advantages as well as disadvantages of each method are presented and discussed in light of the experiments. Various microsystem applications using the above glass patterning technologies like thermal sensors, hermetically packaged capacitive silicon resonators, optical modulator devices, glass microfluidics, micro-heaters, and vacuum-sealed capacitive micromachined ultrasonic transducer arrays are reported.