A self-consistent reduced order model for current and temperature in GaN HEMTs

M. Gupta, A. Vallabhaneni, Satish Kumar
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引用次数: 2

Abstract

A physics-based reduced order self-consistent electro-thermal model is presented for AlGaN/GaN HEMT to obtain current and temperature in the device. The model uses device geometry and temperature dependent material properties as input parameters and requires minimal fitting parameters. The model has the ability to include the effects of self-heating, thermal spreading, and thermal cross-talk in a multi-finger device. The model is validated with the experimental data and physical simulations for single and multi-finger cases and provides reasonably accurate predictions for both current and temperature in the device. The model can capture the spatial variation of temperature profile across the device and therefore, can predict the finger-level variation in the drain current in a multi-finger HEMT. The model is computationally efficient, and can be used for design and analysis of GaN based devices and systems.
GaN hemt中电流和温度的自一致降阶模型
提出了一种基于物理的AlGaN/GaN HEMT降阶自洽电热模型,以获得器件内的电流和温度。该模型使用器件几何形状和与温度相关的材料属性作为输入参数,并且需要最小的拟合参数。该模型能够在多指设备中包含自热、热扩散和热串扰的影响。该模型通过单指和多指情况下的实验数据和物理模拟进行了验证,并对器件中的电流和温度提供了相当准确的预测。该模型能够捕捉到整个器件温度分布的空间变化,因此可以预测多指HEMT漏极电流的指级变化。该模型计算效率高,可用于GaN基器件和系统的设计和分析。
本文章由计算机程序翻译,如有差异,请以英文原文为准。
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