{"title":"Experimental demonstration of integrated horizontal Cu-Si3N4-Cu plasmonic waveguide and passive components","authors":"Shiyang Zhu, G. Lo, D. Kwong","doi":"10.1109/PGC.2012.6457949","DOIUrl":null,"url":null,"abstract":"The Si<sub>3</sub>N<sub>4</sub> waveguide offers very low propagation loss and feasibility for three-dimensional photonic integration, but it suffers from large optical mode size (thus low integration density) due to the relatively small refractive index contrast between the Si<sub>3</sub>N<sub>4</sub> core and the SiO<sub>2</sub> cladding. On the other hand, the metal-insulator-metal plasmonic waveguide offers very tight light confinement but it suffers from large propagation loss. In this work, we integrate Cu-Si<sub>3</sub>N<sub>4</sub>-Cu nanoplasmonic waveguides along with various passive components with the conventional Si<sub>3</sub>N<sub>4</sub> waveguides. The Cu-Si<sub>3</sub>N<sub>4</sub>-Cu waveguide exhibits ~0.37-dB/μm propagation loss at telecommunication wavelengths of 1550 nm and ~45% coupling efficiency with the conventional 1-μm-wide S<sub>3</sub>N<sub>4</sub> waveguide through a simple 2-μm-long tapered coupler. Ultracompact 1×2 and 1×4 plasmonic power splitters can split light almost equally with an excess loss of ~3.5 dB and ~1 dB, respectively.","PeriodicalId":158783,"journal":{"name":"2012 Photonics Global Conference (PGC)","volume":"26 1","pages":"0"},"PeriodicalIF":0.0000,"publicationDate":"2012-12-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"0","resultStr":null,"platform":"Semanticscholar","paperid":null,"PeriodicalName":"2012 Photonics Global Conference (PGC)","FirstCategoryId":"1085","ListUrlMain":"https://doi.org/10.1109/PGC.2012.6457949","RegionNum":0,"RegionCategory":null,"ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"","JCRName":"","Score":null,"Total":0}
引用次数: 0
Abstract
The Si3N4 waveguide offers very low propagation loss and feasibility for three-dimensional photonic integration, but it suffers from large optical mode size (thus low integration density) due to the relatively small refractive index contrast between the Si3N4 core and the SiO2 cladding. On the other hand, the metal-insulator-metal plasmonic waveguide offers very tight light confinement but it suffers from large propagation loss. In this work, we integrate Cu-Si3N4-Cu nanoplasmonic waveguides along with various passive components with the conventional Si3N4 waveguides. The Cu-Si3N4-Cu waveguide exhibits ~0.37-dB/μm propagation loss at telecommunication wavelengths of 1550 nm and ~45% coupling efficiency with the conventional 1-μm-wide S3N4 waveguide through a simple 2-μm-long tapered coupler. Ultracompact 1×2 and 1×4 plasmonic power splitters can split light almost equally with an excess loss of ~3.5 dB and ~1 dB, respectively.