Fundamental Insight on Morphological Changes of Graphene Nanoplatelets-Copper (GNP-Cu) Coatings: Effects of Repetitive Pool Boiling Tests

A. Rishi, Anju Gupta
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引用次数: 3

Abstract

Being an extremely vigorous process involving a continuous intense bubble activity, repetitive pool boiling study is essential for many industrial applications. In this work, we have utilized highly thermally conductive and highly wettable graphene nanoplatelets (GNP) to form GNP-Copper based composite coatings for enhancing the pool boiling heat transfer performance. A multi-step electrodeposition technique was implemented to develop robust coatings on the copper substrates. Repetitive pool boiling studies were conducted on the 2% GNP-Cu coating which achieved the highest CHF of 286 W/cm2 and HTC of 204 kW/m2-°C. After investigating the effect of repetitive boiling on deposited GNP layers and morphology, it was found that GNP were reduced to form r-GNP (reduced GNP) and small increment in pore sizes was observed. Additionally, with repetitive boiling, it was observed that the heat transfer coefficient was continuously increased and compared to pristine copper surface 2% GNP-Cu coating yielded ∼456% increment in HTC at the end of third repetitive test.
石墨烯纳米板-铜(GNP-Cu)涂层形态变化的基本见解:重复池沸腾试验的影响
作为一个涉及连续剧烈气泡活动的极其剧烈的过程,重复池沸腾研究对于许多工业应用是必不可少的。在这项工作中,我们利用高导热和高可湿性的石墨烯纳米片(GNP)形成GNP-铜基复合涂层,以提高池沸腾传热性能。采用多步骤电沉积技术在铜基底上制备了坚固耐用的涂层。对2% GNP-Cu涂层进行了重复池沸实验,CHF最高达到286 W/cm2, HTC最高达到204 kW/m2-°C。在研究了重复沸腾对沉积GNP层和形貌的影响后,发现GNP被还原为r-GNP(还原GNP),并且观察到孔径的微小增加。此外,通过重复煮沸,观察到传热系数不断增加,与原始铜表面相比,在第三次重复测试结束时,2% GNP-Cu涂层的HTC增加了~ 456%。
本文章由计算机程序翻译,如有差异,请以英文原文为准。
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