Photonic Wire Bonding for Silicon Photonics III-V Laser Integration

2021 IEEE 17th International Conference on Group IV Photonics (GFP) Pub Date : 2021-12-01 DOI:10.1109/GFP51802.2021.9673842

Matthew Mitchell, B. Lin, I. Taghavi, Shangxuan Yu, Donald Witt, Kashif M. Awan, S. Gou, Jeff Young, L. Chrostowski

引用次数: 2

Abstract

Photonic wire bonding offers the opportunity to co-package lasers and silicon chips, solving a long-standing problem in integrated photonics, and enabling foundries to offer multi-project wafer runs featuring integrated lasers.

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硅光子学III-V激光集成中的光子线键合

光子线键合为激光器和硅芯片的共封装提供了机会，解决了集成光子学中长期存在的问题，并使代工厂能够提供具有集成激光器的多项目晶圆运行。

本文章由计算机程序翻译，如有差异，请以英文原文为准。

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来源期刊

2021 IEEE 17th International Conference on Group IV Photonics (GFP)

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