High Density 3-D Integration Technology for Massively Parallel Signal Processing in Advanced Infrared Focal Plane Array Sensors

2006 International Electron Devices Meeting Pub Date : 2006-12-10 DOI:10.1109/IEDM.2006.346980

D. Temple, C. Bower, D. Malta, J.E. Robinson, P.R. Coffinan, M. Skokan, T. Welch

引用次数: 26

Abstract

The paper describes a platform technology for three-dimensional (3-D) integration of multiple layers of silicon integrated circuits. The technology promises to dramatically enhance on-chip signal processing capabilities of a variety of sensor and actuator devices hybridized with Si electronics. Among these applications are high performance infrared focal plane array detectors

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先进红外焦平面阵列传感器大规模并行信号处理的高密度三维集成技术

本文介绍了一种多层硅集成电路三维集成的平台技术。该技术有望显著提高芯片上的信号处理能力，各种传感器和执行器设备与硅电子杂交。这些应用包括高性能红外焦平面阵列探测器

本文章由计算机程序翻译，如有差异，请以英文原文为准。

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来源期刊

2006 International Electron Devices Meeting

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