Degradation of a single aluminum junction due to electro-migration

R. Malucci
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引用次数: 3

Abstract

A set of data provided in the literature was reported to show the impact of electro-migration on aluminum junctions. These junctions were fabricated by machining aluminum foil to provide a small connection between two conducting halves. The results appeared to show high current densities cause rapid degradation due to void and crack formation. These results are thought to occur as a result of mass transport due to electro-migration. In the present paper, a degradation model is provided using electro-migration considerations and the geometry in the work mentioned above. This approach uses estimated current flow paths and their associated current density distributions. The current densities are estimated using electromagnetic theory and the junction geometry. Moreover, the estimated effects over time of current density on the local variation of conductivity are incorporated into the model using percolation theory. Consequently, the current flow, current densities and degradation model are used in conjunction to conduct a numerical analysis of the degradation of a single aluminum junction. The approach exhibits how a model with these elements provides insight into the degradation process due to electro-migration. It is seen that this approach shows reasonably good agreement between theory and experiment providing a basis for analyzing electro-migration degradation in a variety of general cases.
由电迁移引起的单个铝结的退化
文献中提供的一组数据显示了电迁移对铝结的影响。这些结是通过加工铝箔来制造的,在两个导体之间提供一个小的连接。结果表明,高电流密度会导致由于空洞和裂纹的形成而快速降解。这些结果被认为是由于电迁移引起的质量传递的结果。在本文中,利用上述工作中的电迁移考虑和几何结构提供了一个退化模型。这种方法使用估计的电流路径及其相关的电流密度分布。利用电磁理论和结的几何形状估计了电流密度。此外,利用渗流理论将电流密度随时间对电导率局部变化的估计影响纳入模型。因此,结合电流、电流密度和降解模型对单个铝结的降解进行了数值分析。该方法展示了具有这些元素的模型如何提供由于电迁移而导致的降解过程的洞察力。该方法在理论和实验上有较好的一致性,为分析各种一般情况下的电迁移退化提供了基础。
本文章由计算机程序翻译,如有差异,请以英文原文为准。
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