Eliminating Word Line Bending In Floating Gate NOR Flash Memory To Reduce Array Size and Improve Manufacturability

S. Fang, Kuo-Tung Chang, Sung-Chul Lee, J. Reiss, M. Takahashi, M. Plat, S. Ho, A. Rangarajan, Wing Leung, M. Kwan, Sheung-Hee Park, K. Ko, A. Joshi, H. Kinoshita, J. Wang, Yu Sun, K. Mizutani, H. Ogawa
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Abstract

In floating gate (FG) NOR flash memory arrays, word lines (WL) bend at Vss columns to accommodate the Vss contacts. As the memory cell is scaled down, patterning of the WL bending becomes more and more challenging. Furthermore, to ensure that the WL bending does not extend to the adjacent memory cells to cause abnormal electrical characteristics of the adjacent cells, we have to increase the Vss column width to three or more pitches. The wider Vss columns result in unequal line and spacing, which makes a significant impact on the process window of several modules. Therefore, the WL bending is a process limiter to core cell scaling and manufacturing. In this work, we have succeeded in a device approach to eliminate the WL bending by an additional mask and implant to connect Vss lines and contacts through conductive Vss transistors. The new memory array without WL bending shows comparable device performance and improves manufacturability significantly.
消除浮栅NOR快闪记忆体字线弯曲以减少阵列尺寸及提高制造性
在浮栅(FG) NOR闪存阵列中,字线(WL)在Vss列处弯曲以容纳Vss触点。随着存储单元的缩小,WL弯曲的图形化变得越来越具有挑战性。此外,为了确保WL弯曲不会延伸到相邻的存储单元,从而导致相邻单元的异常电特性,我们必须将Vss列宽度增加到三个或更多节距。较宽的Vss列导致线和间距不等,这对多个模块的处理窗口产生了重大影响。因此,WL弯曲是芯单元缩放和制造的工艺限制因素。在这项工作中,我们成功地采用了一种器件方法,通过额外的掩膜和植入物通过导电的Vss晶体管连接Vss线和触点,从而消除了WL弯曲。无WL弯曲的新型存储阵列具有相当的器件性能,并显著提高了可制造性。
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