An Integrated Field Emission Electron Source on a Chip Fabricated by Laser-Micromachining and Mems Technology

M. Hausladen, P. Buchner, A. Schels, S. Edler, M. Bachmann, R. Schreiner
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引用次数: 1

Abstract

A silicon field emission electron source consisting of a cathode and a grid electrode has been fabricated by laser micromachining. The cathode features 21×21 tips on an area of 4×4 mm2, With a self-aligning MEMS technology for the aperture grid, a high electron transmission (99 %) was achieved. Onset voltages of 50…70 V were observed for an emission current of 1 nA. A stable emission current of 1 mA ± 1.3 % at an extraction voltage of 250 V was observed during a 30-min operation.
基于激光微加工和Mems技术的集成场发射电子源芯片
采用激光微加工技术制备了一种由阴极和栅极组成的硅场发射电子源。阴极在4×4 mm2的面积上具有21×21尖端,孔径网格采用自对准MEMS技术,实现了高电子透射率(99%)。发射电流为1 nA时,起始电压为50…70 V。在250 V的萃取电压下,在30分钟的工作时间内,观察到稳定的发射电流为1 mA±1.3%。
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