A Study of the Influence of Solder Thickness on the Thermal Resistance of Power VDMOS Device Package

Abstract

The thermal resistance of the power VDMOS device is an important parameter reflecting its thermal characteristics and reliability. The solder layer is one of the most important component which has a great influence on the thermal resistance. In this paper, three different power VDMOS in ITO-220 package are used as samples to analyze the relationship between the thickness of the solder layer and the thermal resistance. Through the results of finite element simulation and experiment, it is concluded that the thermal resistance is approximately linear with the thickness of solder layer.